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Chemical content BSS84AKW

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
BSS84AKWSOT323SC-705.65710 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340653051156126030 s123520 s3Seremban, Malaysia; Dongguan, China; Kyoto, Japan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.001022.540000.01796
Doped siliconSilicon (Si)7440-21-30.0364191.030000.64365
Gold alloyGold (Au)7440-57-50.002576.430000.04546
subTotal0.04000100.000000.70707
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001830.090000.03233
Carbon (C)7440-44-00.000810.040000.01437
Chromium (Cr)7440-47-30.004270.210000.07543
Cobalt (Co)7440-48-40.008530.420000.15086
Iron (Fe)7439-89-60.9582947.1600016.93962
Manganese (Mn)7439-96-50.017270.850000.30532
Nickel (Ni)7440-02-00.7217735.5200012.75859
Phosphorus (P)7723-14-00.000410.020000.00718
Silicon (Si)7440-21-30.005080.250000.08980
Sulphur (S)7704-34-90.000410.020000.00718
Pure metal layerCopper (Cu)7440-50-80.2649713.040004.68390
Silver (Ag)7440-22-40.048362.380000.85488
subTotal2.03200100.0000035.91946
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.72756
Triphenylphosphine603-35-00.001680.050000.02979
FillerSilica -amorphous-7631-86-92.4264072.0000042.89123
PigmentCarbon black1333-86-40.001680.050000.02979
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000008.93567
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000005.95712
subTotal3.37000100.0000059.57116
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.71178
subTotal0.21000100.000003.71216
WirePure metalCopper (Cu)7440-50-80.00510100.000000.09021
subTotal0.00510100.000000.09021
total5.65710100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.