Chemical content BSS84AKW

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
BSS84AKWSOT323SC-705.65710 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340653051156126030 s123520 s3Seremban, Malaysia; Dongguan, China; Kyoto, Japan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.001022.540000.01796
Doped siliconSilicon (Si)7440-21-30.0364191.030000.64365
Gold alloyGold (Au)7440-57-50.002576.430000.04546
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001830.090000.03233
Carbon (C)7440-44-00.000810.040000.01437
Chromium (Cr)7440-47-30.004270.210000.07543
Cobalt (Co)7440-48-40.008530.420000.15086
Iron (Fe)7439-89-60.9582947.1600016.93962
Manganese (Mn)7439-96-50.017270.850000.30532
Nickel (Ni)7440-02-00.7217735.5200012.75859
Phosphorus (P)7723-14-00.000410.020000.00718
Silicon (Si)7440-21-30.005080.250000.08980
Sulphur (S)7704-34-90.000410.020000.00718
Pure metal layerCopper (Cu)7440-50-80.2649713.040004.68390
Silver (Ag)7440-22-40.048362.380000.85488
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.72756
FillerSilica -amorphous-7631-86-92.4264072.0000042.89123
PigmentCarbon black1333-86-40.001680.050000.02979
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000008.93567
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000005.95712
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.71178
WirePure metalCopper (Cu)7440-50-80.00510100.000000.09021
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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