Chemical content BSS84AKW

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Type numberPackagePackage descriptionTotal product weight
BSS84AKWSOT323SC-705.65710 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340653051156126030 s123520 s3Seremban, Malaysia; Dongguan, China; Kyoto, Japan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.001022.540000.01796
Doped siliconSilicon (Si)7440-21-30.0364191.030000.64365
Gold alloyGold (Au)7440-57-50.002576.430000.04546
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001830.090000.03233
Carbon (C)7440-44-00.000810.040000.01437
Chromium (Cr)7440-47-30.004270.210000.07543
Cobalt (Co)7440-48-40.008530.420000.15086
Iron (Fe)7439-89-60.9582947.1600016.93962
Manganese (Mn)7439-96-50.017270.850000.30532
Nickel (Ni)7440-02-00.7217735.5200012.75859
Phosphorus (P)7723-14-00.000410.020000.00718
Silicon (Si)7440-21-30.005080.250000.08980
Sulphur (S)7704-34-90.000410.020000.00718
Pure metal layerCopper (Cu)7440-50-80.2649713.040004.68390
Silver (Ag)7440-22-40.048362.380000.85488
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.72756
FillerSilica -amorphous-7631-86-92.4264072.0000042.89123
PigmentCarbon black1333-86-40.001680.050000.02979
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000008.93567
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000005.95712
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.71178
WirePure metalCopper (Cu)7440-50-80.00510100.000000.09021
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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