Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BST39

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BST39SOT89MPT340.326528 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93351629011513126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.08470077.0000000.210035
PolymerResin systemProprietary0.02530023.0000000.062738
subTotal0.110000100.0000000.272773
DieDoped siliconSilicon (Si)7440-21-30.150000100.0000000.371964
subTotal0.150000100.0000000.371964
Lead FrameCopper alloyCopper (Cu)7440-50-817.12911299.82000042.476040
Iron (Fe)7439-89-60.0171600.1000000.042553
Phosphorus (P)7723-14-00.0051480.0300000.012766
Pure metal layerSilver (Ag)7440-22-40.0085800.0500000.021276
subTotal17.160000100.00000042.552634
Mould CompoundAdditiveNon hazardousProprietary0.6614902.9000001.640335
Triphenylphosphine603-35-00.0114050.0500000.028282
FillerSilica -amorphous-7631-86-916.42320072.00000040.725549
PigmentCarbon black1333-86-40.0114050.0500000.028282
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.42150015.0000008.484489
Phenol Formaldehyde resin (generic)9003-35-42.28100010.0000005.656326
subTotal22.810000100.00000056.563263
Post-PlatingImpurityLead (Pb)7439-92-10.0000030.0045000.000008
Non hazardousProprietary0.0000390.0555000.000096
Tin solderTin (Sn)7440-31-50.06995899.9400000.173479
subTotal0.070000100.0000000.173583
WirePure metalGold (Au)7440-57-50.026528100.0000000.065783
subTotal0.026528100.0000000.065783
total40.326528100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.