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Chemical content BST52

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Type numberPackagePackage descriptionTotal product weight
BST52SOT89MPT340.43386 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9336442701351212601235D-22529 HAMBURG, Germany; Dongguan, China 
9336442701151212601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0847077.000000.20948
PolymerResin systemProprietary0.0253023.000000.06257
subTotal0.11000100.000000.27205
DieDoped siliconSilicon (Si)7440-21-30.24000100.000000.59356
subTotal0.24000100.000000.59356
Lead FrameCopper alloyCopper (Cu)7440-50-817.1291199.8200042.36329
Iron (Fe)7439-89-60.017160.100000.04244
Phosphorus (P)7723-14-00.005150.030000.01273
Pure metal layerSilver (Ag)7440-22-40.008580.050000.02122
subTotal17.16000100.0000042.43968
Mould CompoundAdditiveNon hazardousProprietary0.661492.900001.63598
Triphenylphosphine603-35-00.011400.050000.02821
FillerSilica -amorphous-7631-86-916.4232072.0000040.61744
PigmentCarbon black1333-86-40.011400.050000.02821
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.4215015.000008.46197
Phenol Formaldehyde resin (generic)9003-35-42.2810010.000005.64131
subTotal22.81000100.0000056.41312
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00001
Non hazardousProprietary0.000040.055500.00010
Tin solderTin (Sn)7440-31-50.0699699.940000.17302
subTotal0.07000100.000000.17313
WirePure metalGold (Au)7440-57-50.04386100.000000.10849
subTotal0.04386100.000000.10849
total40.43386100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.