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Chemical content BUK6D30-40E

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Type numberPackagePackage descriptionTotal product weight
BUK6D30-40ESOT1220SOT12207.34754 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661473115112601235Hsin-chu, Taiwan; Manchester, United Kingdom; Sherman, United States Of America; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000701.000000.00953
FillerSilver (Ag)7440-22-40.0588084.000000.80027
PolymerBismaleimidodiphenylmethane resin 0.0070010.000000.09527
Isobornyl Methacrylate7534-94-30.003505.000000.04763
subTotal0.07000100.000000.95270
DieDoped siliconSilicon (Si)7440-21-30.47000100.000006.39670
subTotal0.47000100.000006.39670
Lead FrameCopper alloyCopper (Cu)7440-50-82.7049193.5956036.81386
Magnesium (Mg)7439-95-40.004220.145900.05739
Nickel (Ni)7440-02-00.084352.918801.14805
Silicon (Si)7440-21-30.018280.632400.24874
Pure metal layerGold (Au)7440-57-50.000960.033300.01310
Nickel (Ni)7440-02-00.074012.561001.00732
Palladium (Pd)7440-05-30.003270.113000.04445
subTotal2.89000100.0000039.33291
Mould CompoundFillerSilica -amorphous-7631-86-90.8579023.0000011.67602
Silica fused60676-86-02.2380060.0000030.45917
Flame retardantMetal hydroxideProprietary0.111903.000001.52296
ImpurityBismuth (Bi)7440-69-90.018650.500000.25383
PigmentCarbon black1333-86-40.018650.500000.25383
PolymerEpoxy resin systemProprietary0.261107.000003.55357
Phenolic resinProprietary0.223806.000003.04592
subTotal3.73000100.0000050.76530
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00128
Tin solderTin (Sn)7440-31-50.1699099.940002.31231
subTotal0.17000100.000002.31369
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0175499.990000.23873
subTotal0.01754100.000000.23875
total7.34754100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.