Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK6D56-60E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK6D56-60ESOT1220DFN2020MD-67.347543 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9346604711153126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.05600080.0000000.762160
PolymerAcrylic resinProprietary0.01400020.0000000.190540
subTotal0.070000100.0000000.952699
DieDoped siliconSilicon (Si)7440-21-30.470000100.0000006.396696
subTotal0.470000100.0000006.396696
Lead FrameCopper alloyCopper (Cu)7440-50-82.70491393.59560036.813842
Magnesium (Mg)7439-95-40.0042170.1459000.057387
Nickel (Ni)7440-02-00.0843532.9188001.148048
Silicon (Si)7440-21-30.0182760.6324000.248741
Pure metal layerGold (Au)7440-57-50.0009620.0333000.013098
Nickel (Ni)7440-02-00.0740132.5610001.007315
Palladium (Pd)7440-05-30.0032660.1130000.044446
subTotal2.890000100.00000039.332876
Mould CompoundFillerSilica -amorphous-7631-86-90.85790023.00000011.676012
Silica fused60676-86-02.23800060.00000030.459162
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-20.1119003.0000001.522958
Ion trapping agentBismuth (Bi)7440-69-90.0186500.5000000.253826
PigmentCarbon black1333-86-40.0186500.5000000.253826
PolymerEpoxy resin systemProprietary0.2611007.0000003.553569
Phenolic resinProprietary0.2238006.0000003.045916
subTotal3.730000100.00000050.765269
Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000104
Non hazardousProprietary0.0000940.0555000.001284
Tin solderTin (Sn)7440-31-50.16989899.9400002.312310
subTotal0.170000100.0000002.313699
WireImpurityNon hazardousProprietary0.0000020.0100000.000024
Pure metalCopper (Cu)7440-50-80.01754199.9900000.238729
subTotal0.017542100.0000000.238753
total7.347543100.000000100.000000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.