Chemical content BUK7J1R4-40H

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Type numberPackagePackage descriptionTotal product weight
BUK7J1R4-40HSOT10234 LEADS113.65000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346600821153126030 s126020 s3Newport, United Kingdom; Cabuyao, Philippines; Hsin-chu, Taiwan; Manchester, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.40000100.000001.23185
ClipCopper alloyCopper (Cu)7440-50-827.3452099.8000024.06089
Iron (Fe)7439-89-60.041100.150000.03616
Phosphorus (P)7723-14-00.013700.050000.01205
Lead FrameCopper alloyCopper (Cu)7440-50-840.3474899.8700035.50152
Iron (Fe)7439-89-60.040400.100000.03555
Phosphorus (P)7723-14-00.012120.030000.01066
Mould CompoundFillerSilica fused60676-86-018.8108062.0000016.55152
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-24.7027015.500004.13788
ImpuritySilicon Dioxide (SiO2)14808-60-70.060680.200000.05339
PigmentCarbon black1333-86-40.151700.500000.13348
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.3374011.000002.93656
Phenolic resinProprietary2.669928.800002.34925
Tetramethylbiphenyl diglycidyl ether85954-11-60.606802.000000.53392
Post-PlatingPure metalTin (Sn)7440-31-51.73000100.000001.52222
Solder PasteLead alloyLead (Pb)7439-92-13.4410092.500003.02772
Silver (Ag)7440-22-40.093002.500000.08183
Tin (Sn)7440-31-50.186005.000000.16366
Solder PasteImpurityAntimony (Sb)7440-36-00.002600.030000.00229
Lead alloyLead (Pb)7439-92-18.0079092.470007.04611
Silver (Ag)7440-22-40.216502.500000.19050
Tin (Sn)7440-31-50.433005.000000.38099
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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