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Chemical content BUK7M15-40H

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Type numberPackagePackage descriptionTotal product weight
BUK7M15-40HSOT1210mLFPAK35.36000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660788115212601260Hsin-chu, Taiwan; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.59000100.000001.66855
subTotal0.59000100.000001.66855
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000016.08767
Iron (Fe)7439-89-60.008550.150000.02418
Phosphorus (P)7723-14-00.002850.050000.00806
subTotal5.70000100.0000016.11991
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000039.23133
Iron (Fe)7439-89-60.020850.150000.05896
Phosphorus (P)7723-14-00.006950.050000.01965
subTotal13.90000100.0000039.30994
Mould CompoundFillerSilica fused60676-86-05.2886062.0000014.95645
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.3221515.500003.73911
ImpuritySilicon Dioxide (SiO2)14808-60-70.017060.200000.04825
PigmentCarbon black1333-86-40.042650.500000.12062
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9383011.000002.65356
Phenolic resinProprietary0.750648.800002.12285
Tetramethylbiphenyl diglycidyl ether85954-11-60.170602.000000.48247
subTotal8.53000100.0000024.12331
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00109
Tin alloyTin (Sn)7440-31-53.8496299.9900010.88692
subTotal3.85000100.0000010.88801
Solder PasteLead alloyLead (Pb)7439-92-12.5807592.500007.29850
Silver (Ag)7440-22-40.069752.500000.19726
Tin (Sn)7440-31-50.139505.000000.39451
subTotal2.79000100.000007.89027
total35.36000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.