Chemical content BUK7S1R2-40H

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Type numberPackagePackage descriptionTotal product weight
BUK7S1R2-40HSOT1235LFPAK88336.73000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346611031184126030 s126020 s3Hsin-chu, Taiwan; Seremban, Malaysia; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.50000100.000000.44546
ClipCopper alloyCopper (Cu)7440-50-843.1445199.8600012.81279
Iron (Fe)7439-89-60.047530.110000.01411
Phosphorus (P)7723-14-00.012960.030000.00385
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600051.35496
Iron (Fe)7439-89-60.225120.130000.06686
Phosphorus (P)7723-14-00.051950.030000.01543
Mould CompoundFillerSilica fused60676-86-063.3330062.0000018.80824
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.70206
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.06067
PigmentCarbon black1333-86-40.510750.500000.15168
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.043002.000000.60672
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.33695
Phenolic resinProprietary8.989208.800002.66956
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00014
Tin alloyTin (Sn)7440-31-54.8795199.990001.44909
Solder PasteImpurityAntimony (Sb)7440-36-00.002480.030000.00074
Lead alloyLead (Pb)7439-92-17.6472792.470002.27104
Silver (Ag)7440-22-40.206752.500000.06140
Tin (Sn)7440-31-50.413505.000000.12280
Solder PasteImpurityAntimony (Sb)7440-36-00.001420.040000.00042
Lead alloyLead (Pb)7439-92-13.2826892.470000.97487
Silver alloySilver (Ag)7440-22-40.088752.500000.02636
Tin alloyTin (Sn)7440-31-50.177505.000000.05271
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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