Chemical content BUK7S2R0-40H

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Type numberPackagePackage descriptionTotal product weight
BUK7S2R0-40HSOT1235LFPAK88327.83400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346613161185126030 s126020 s3Cabuyao, Philippines; Seremban, Malaysia; Hsin-chu, TaiwanLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.99000100.000000.30198
ClipCopper alloyCopper (Cu)7440-50-836.5627499.8600011.15282
Iron (Fe)7439-89-60.040280.110000.01229
Phosphorus (P)7723-14-00.010980.030000.00335
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600052.74851
Iron (Fe)7439-89-60.225120.130000.06867
Phosphorus (P)7723-14-00.051950.030000.01585
Mould CompoundFillerSilica fused60676-86-063.3330062.0000019.31862
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.82965
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.06232
PigmentCarbon black1333-86-40.510750.500000.15580
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.043002.000000.62318
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.42750
Phenolic resinProprietary8.989208.800002.74200
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00015
Tin alloyTin (Sn)7440-31-54.8795199.990001.48841
Solder PasteImpurityAntimony (Sb)7440-36-00.002110.030000.00064
Lead alloyLead (Pb)7439-92-16.4913992.470001.98009
Silver (Ag)7440-22-40.175502.500000.05353
Tin (Sn)7440-31-50.351005.000000.10707
Solder PasteImpurityAntimony (Sb)7440-36-00.001200.040000.00037
Lead alloyLead (Pb)7439-92-12.7833592.470000.84901
Silver alloySilver (Ag)7440-22-40.075252.500000.02295
Tin alloyTin (Sn)7440-31-50.150505.000000.04591
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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