Chemical content BUK7S2R5-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK7S2R5-40HSOT1235LFPAK88327.60400 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346613171185126030 s126020 s3Seremban, Malaysia; Manchester, United Kingdom; Cabuyao, Philippines; Hsin-chu, Taiwan; Newport, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.76000100.000000.23199
ClipCopper alloyCopper (Cu)7440-50-836.5627499.8600011.16065
Iron (Fe)7439-89-60.040280.110000.01229
Phosphorus (P)7723-14-00.010980.030000.00335
Lead FrameCopper alloyCopper (Cu)7440-50-8172.9275699.8600052.78555
Iron (Fe)7439-89-60.225120.130000.06872
Phosphorus (P)7723-14-00.051950.030000.01586
Mould CompoundFillerSilica fused60676-86-063.3330062.0000019.33218
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-215.8332515.500004.83305
ImpuritySilicon Dioxide (SiO2)14808-60-70.204300.200000.06236
PigmentCarbon black1333-86-40.510750.500000.15590
Polymer3,3',5,5'-Tetramethyl-4,4'-dihydroxybiphenyl diglycidyl ether homopolymer89118-70-72.043002.000000.62362
Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-211.2365011.000003.42990
Phenolic resinProprietary8.989208.800002.74392
Post-PlatingImpurityNon hazardousProprietary0.000490.010000.00015
Tin alloyTin (Sn)7440-31-54.8795199.990001.48945
Solder PasteImpurityAntimony (Sb)7440-36-00.002110.030000.00064
Lead alloyLead (Pb)7439-92-16.4913992.470001.98148
Silver (Ag)7440-22-40.175502.500000.05357
Tin (Sn)7440-31-50.351005.000000.10714
Solder PasteImpurityAntimony (Sb)7440-36-00.001200.040000.00037
Lead alloyLead (Pb)7439-92-12.7833592.470000.84961
Silver alloySilver (Ag)7440-22-40.075252.500000.02297
Tin alloyTin (Sn)7440-31-50.150505.000000.04594
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.