Chemical content BUK7S2R5-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

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Type number	Package	Package description	Total product weight
BUK7S2R5-40H	SOT1235	LFPAK88	327.60400 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934661317118	5	1	260		1	260			Seremban, Malaysia; Manchester, United Kingdom; Cabuyao, Philippines; Hsin-chu, Taiwan; Newport, United Kingdom

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.76000	100.00000	0.23199
		subTotal		0.76000	100.00000	0.23199

Clip	Copper alloy	Copper (Cu)	7440-50-8	36.56274	99.86000	11.16065
		Iron (Fe)	7439-89-6	0.04028	0.11000	0.01229
		Phosphorus (P)	7723-14-0	0.01098	0.03000	0.00335
		subTotal		36.61400	100.00000	11.17629

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	172.92756	99.86000	52.78555
		Iron (Fe)	7439-89-6	0.22512	0.13000	0.06872
		Phosphorus (P)	7723-14-0	0.05195	0.03000	0.01586
		subTotal		173.17000	100.00000	52.87013

Mould Compound	Filler	Silica fused	60676-86-0	63.33300	62.00000	19.33218
	Flame retardant	Aluminium Hydroxide (Al(OH)3)	21645-51-2	15.83325	15.50000	4.83305
	Impurity	Silicon Dioxide (SiO2)	14808-60-7	0.20430	0.20000	0.06236
	Pigment	Carbon black	1333-86-4	0.51075	0.50000	0.15590
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	11.23650	11.00000	3.42990
		Phenolic resin	Proprietary	8.98920	8.80000	2.74392
		Tetramethylbiphenyl diglycidyl ether	85954-11-6	2.04300	2.00000	0.62362
		subTotal		102.15000	100.00000	31.18093

Post-Plating	Impurity	Non hazardous	Proprietary	0.00049	0.01000	0.00015
	Tin alloy	Tin (Sn)	7440-31-5	4.87951	99.99000	1.48945
		subTotal		4.88000	100.00000	1.48960

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00211	0.03000	0.00064
	Lead alloy	Lead (Pb)	7439-92-1	6.49139	92.47000	1.98148
		Silver (Ag)	7440-22-4	0.17550	2.50000	0.05357
		Tin (Sn)	7440-31-5	0.35100	5.00000	0.10714
		subTotal		7.02000	100.00000	2.14283

Solder Paste	Impurity	Antimony (Sb)	7440-36-0	0.00120	0.04000	0.00037
	Lead alloy	Lead (Pb)	7439-92-1	2.78335	92.47000	0.84961
	Silver alloy	Silver (Ag)	7440-22-4	0.07525	2.50000	0.02297
	Tin alloy	Tin (Sn)	7440-31-5	0.15050	5.00000	0.04594
		subTotal		3.01000	100.00000	0.91889

		total		327.60400	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.