Chemical content BUK7Y3R0-40H

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Type numberPackagePackage descriptionTotal product weight
BUK7Y3R0-40HSOT669LFPAK100.99000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660085115312601260Cabuyao, Philippines; Manchester, United Kingdom; Hsin-chu, Taiwan; Newport, United KingdomLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.66000100.000000.65353
ClipCopper alloyCopper (Cu)7440-50-827.3452099.8000027.07714
Iron (Fe)7439-89-60.041100.150000.04070
Phosphorus (P)7723-14-00.013700.050000.01357
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100037.46705
Iron (Fe)7439-89-60.056860.150000.05631
Phosphorus (P)7723-14-00.015160.040000.01502
Mould CompoundFillerSilica fused60676-86-013.9686062.0000013.83167
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-23.4921515.500003.45792
ImpuritySilicon Dioxide (SiO2)14808-60-70.045060.200000.04462
PigmentCarbon black1333-86-40.112650.500000.11155
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-22.4783011.000002.45401
Phenolic resinProprietary1.982648.800001.96320
Tetramethylbiphenyl diglycidyl ether85954-11-60.450602.000000.44618
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00038
Tin alloyTin (Sn)7440-31-53.8496299.990003.81188
Solder PasteLead alloyLead (Pb)7439-92-12.3957592.500002.37226
Silver (Ag)7440-22-40.064752.500000.06412
Tin (Sn)7440-31-50.129505.000000.12823
Solder PasteImpurityAntimony (Sb)7440-36-00.001820.030000.00180
Lead alloyLead (Pb)7439-92-15.5944492.470005.53959
Silver (Ag)7440-22-40.151252.500000.14977
Tin (Sn)7440-31-50.302505.000000.29953
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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