Chemical content BUK9J0R9-40H

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9J0R9-40HSOT10234 LEADS115.35000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934660369115312601260Hsin-chu, Taiwan; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.70000100.000001.47378
ClipCopper alloyCopper (Cu)7440-50-827.3452099.8000023.70629
Iron (Fe)7439-89-60.041100.150000.03563
Phosphorus (P)7723-14-00.013700.050000.01188
Lead FrameCopper alloyCopper (Cu)7440-50-840.3474899.8700034.97831
Iron (Fe)7439-89-60.040400.100000.03502
Phosphorus (P)7723-14-00.012120.030000.01051
Mould CompoundFillerSilica fused60676-86-018.8108062.0000016.30759
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-24.7027015.500004.07690
ImpuritySilicon Dioxide (SiO2)14808-60-70.060680.200000.05261
PigmentCarbon black1333-86-40.151700.500000.13151
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-23.3374011.000002.89328
Phenolic resinProprietary2.669928.800002.31463
Tetramethylbiphenyl diglycidyl ether85954-11-60.606802.000000.52605
Post-PlatingImpurityNon hazardousProprietary0.000170.010000.00015
Tin alloyTin (Sn)7440-31-51.7298399.990001.49963
Solder PasteLead alloyLead (Pb)7439-92-13.8295092.500003.31990
Silver (Ag)7440-22-40.103502.500000.08973
Tin (Sn)7440-31-50.207005.000000.17945
Solder PasteImpurityAntimony (Sb)7440-36-00.002890.030000.00251
Lead alloyLead (Pb)7439-92-18.9141192.470007.72788
Silver (Ag)7440-22-40.241002.500000.20893
Tin (Sn)7440-31-50.482005.000000.41786
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.