Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9K29-100E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BUK9K29-100ESOT1205LFPAK56D98.950000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340669751155126030 s126020 s3Leaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-34.000000100.0000004.042446
subTotal4.000000100.0000004.042446
ClipCopper alloyCopper (Cu)7440-50-813.17360099.80000013.313391
Iron (Fe)7439-89-60.0198000.1500000.020010
Phosphorus (P)7723-14-00.0066000.0500000.006670
subTotal13.200000100.00000013.340071
Lead FrameCopper alloyCopper (Cu)7440-50-835.32920099.80000035.704093
Iron (Fe)7439-89-60.0531000.1500000.053663
Phosphorus (P)7723-14-00.0177000.0500000.017888
subTotal35.400000100.00000035.775644
Mould CompoundAdditiveNon hazardousProprietary1.8908005.8000001.910864
FillerSilica -amorphous-7631-86-92.0538006.3000002.075594
Silica fused60676-86-023.47200072.00000023.721071
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.6520002.0000000.658919
PigmentCarbon black1333-86-40.0978000.3000000.098838
PolymerBromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.7172002.2000000.724811
Epoxy resin systemProprietary1.9560006.0000001.976756
Phenol Formaldehyde resin (generic)9003-35-41.7604005.4000001.779080
subTotal32.600000100.00000032.945932
Post-PlatingImpurityNon hazardousProprietary0.0001930.0100000.000195
Tin alloyTin (Sn)7440-31-51.92980799.9900001.950285
subTotal1.930000100.0000001.950480
Solder PasteLead alloyLead (Pb)7439-92-12.55300092.5000002.580091
Silver (Ag)7440-22-40.0690002.5000000.069732
Tin (Sn)7440-31-50.1380005.0000000.139464
subTotal2.760000100.0000002.789288
Solder PasteImpurityAntimony (Sb)7440-36-00.0027180.0300000.002747
Lead alloyLead (Pb)7439-92-18.37778292.4700008.466682
Silver (Ag)7440-22-40.2265002.5000000.228903
Tin (Sn)7440-31-50.4530005.0000000.457807
subTotal9.060000100.0000009.156139
total98.950000100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.