Chemical content BUK9Y19-55B

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Type numberPackagePackage descriptionTotal product weight
BUK9Y19-55BSOT669LFPAK90.91000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340583661151112601260Manchester, United Kingdom; D-22529 HAMBURG, Germany; Seremban, Malaysia; Cabuyao, Philippines; Sherman, United States Of AmericaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-32.60000100.000002.85997
ClipCopper alloyChromium (Cr)7440-47-30.036600.300000.04026
Copper (Cu)7440-50-812.1487699.5800013.36350
Titanium (Ti)7440-32-60.012200.100000.01342
ImpuritySilicon (Si)7440-21-30.002440.020000.00268
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100041.62135
Iron (Fe)7439-89-60.056860.150000.06255
Phosphorus (P)7723-14-00.015160.040000.01668
Mould CompoundAdditiveNon hazardousProprietary0.315421.400000.34696
FillerSilica -amorphous-7631-86-91.419396.300001.56131
Silica fused60676-86-016.2216072.0000017.84358
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.450602.000000.49566
PigmentCarbon black1333-86-40.067590.300000.07435
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.495662.200000.54522
Non hazardousProprietary0.991324.400001.09044
Phenol Formaldehyde resin (generic)9003-35-41.216625.400001.33827
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00042
Tin alloyTin (Sn)7440-31-53.8496299.990004.23453
Solder PasteLead alloyLead (Pb)7439-92-110.9335092.5000012.02673
Silver (Ag)7440-22-40.295502.500000.32505
Tin (Sn)7440-31-50.591005.000000.65009
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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