Chemical content BUK9Y40-55B

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Type numberPackagePackage descriptionTotal product weight
BUK9Y40-55BSOT669LFPAK79.81000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340583671151112601260D-22529 HAMBURG, Germany; Sherman, United States Of America; Seremban, Malaysia; Manchester, United Kingdom; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.60000100.000002.00476
ClipCopper alloyChromium (Cr)7440-47-30.028800.300000.03609
Copper (Cu)7440-50-89.5596899.5800011.97805
Titanium (Ti)7440-32-60.009600.100000.01203
ImpuritySilicon (Si)7440-21-30.001920.020000.00241
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100047.41006
Iron (Fe)7439-89-60.056860.150000.07125
Phosphorus (P)7723-14-00.015160.040000.01900
Mould CompoundAdditiveNon hazardousProprietary0.315421.400000.39521
FillerSilica -amorphous-7631-86-91.419396.300001.77846
Silica fused60676-86-016.2216072.0000020.32527
Flame retardantAntimony Trioxide (Sb2O3)1309-64-40.450602.000000.56459
PigmentCarbon black1333-86-40.067590.300000.08469
Bromophenol/Formaldehyde/Epichlorohydrin polymer68541-56-00.495662.200000.62105
Non hazardousProprietary0.991324.400001.24210
Phenol Formaldehyde resin (generic)9003-35-41.216625.400001.52440
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00048
Tin alloyTin (Sn)7440-31-53.8496299.990004.82347
Solder PasteLead alloyLead (Pb)7439-92-13.9960092.500005.00689
Silver (Ag)7440-22-40.108002.500000.13532
Tin (Sn)7440-31-50.216005.000000.27064
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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