Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BUK9Y8R5-80E

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934067596115BUK9Y8R5-80EXBUK9Y8R5-80ESOT669 (LFPAK)RFS1
REACHCompliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 83565 ppm of the article. SCIP No. 73067ae5-0481-41f5-9748-43d9bd18d7c1.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHSCompliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔点焊料 (如铅含量超过85%(重量百分比)的铅基合金焊料)'.
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1309-64-4: 5585 ppm; substance 1333-86-4: 837 ppm; substance 7439-92-1: 83565 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 68541-56-0: 6143 ppm; substance 1309-64-4: 5585 ppm; substance 1333-86-4: 837 ppm; substance 7439-92-1: 83565 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 2259 ppm;
RHF IndicatorContains EU RoHS-exempted lead and halogens according to Nexperia's halogen-free definition.
RHF-2006 indicator E
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
DieDoped siliconSilicon (Si)7440-21-34.100000100.0000005.081805
Die Total4.100000100.0000005.081805
ClipCopper alloyCopper (Cu)7440-50-84.99338299.8676206.189120
ClipCopper alloyIron (Fe)7439-89-60.0049950.0999100.006191
ClipCopper alloyPhosphorus (P)7723-14-00.0016230.0324700.002012
Clip Total5.000000100.0000006.197323
Lead FrameCopper alloyCopper (Cu)7440-50-837.83797199.81000046.898824
Lead FrameCopper alloyIron (Fe)7439-89-60.0568650.1500000.070482
Lead FrameCopper alloyPhosphorus (P)7723-14-00.0151640.0400000.018795
Lead Frame Total37.910000100.00000046.988101
Mould CompoundFillerSilica fused60676-86-016.22160072.00000020.106098
Mould CompoundFillerSilica7631-86-91.4193906.3000001.759284
Mould CompoundPolymerEpoxy resin system1.3518006.0000001.675508
Mould CompoundAdditiveNon-declarable1.3067405.8000001.619658
Mould CompoundPolymerFormaldehyde-phenol copolymer9003-35-41.2166205.4000001.507957
Mould CompoundPolymerFormaldehyde, polymer with bromophenol and 2-(chloromethyl)oxirane68541-56-00.4956602.2000000.614353
Mould CompoundFlame retardantAntimony trioxide (Sb2O3)1309-64-40.4506002.0000000.558503
Mould CompoundPigmentCarbon black1333-86-40.0675900.3000000.083775
Mould Compound Total22.530000100.00000027.925136
Post-PlatingTin alloyTin (Sn)7440-31-53.84961599.9900004.771462
Post-PlatingImpurityNon-declarable0.0003850.0100000.000477
Post-Plating Total3.850000100.0000004.771939
Solder Paste 1Lead alloyLead (Pb)7439-92-13.71729492.4700004.607454
Solder Paste 1Lead alloyTin (Sn)7440-31-50.2010005.0000000.249132
Solder Paste 1Lead alloySilver (Ag)7440-22-40.1005002.5000000.124566
Solder Paste 1ImpurityAntimony (Sb)7440-36-00.0012060.0300000.001495
Solder Paste 1 Total4.020000100.0000004.982647
Solder Paste 2Lead alloyLead (Pb)7439-92-13.02475092.5000003.749070
Solder Paste 2Lead alloyTin (Sn)7440-31-50.1635005.0000000.202653
Solder Paste 2Lead alloySilver (Ag)7440-22-40.0817502.5000000.101326
Solder Paste 2 Total3.270000100.0000004.053049
BUK9Y8R5-80E Total80.680000100.000000
Notes
Report created on 2025-09-29 09:28:14 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
Pb-free Soldering Pb Soldering No. of Processing Cycles
PPT MPPT PPT MPPT
260 °C40 s235 °C30 s3
Notes
Report created on 2025-09-29 09:28:14 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
半导体芯片 (Die)
夹子 (Clip)
引线框架 (Lead Frame)
模封料 (Mould Compound)
后镀层 (Post-Plating)
锡膏 (Solder Paste)
锡膏 (Solder Paste)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
EFUP Icon 该半导体产品的环保使用期限(EFUP)为50年。
This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
Notes
Report created on 2025-09-29 09:28:14 CEST+0200
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.