Chemical content BZB784-C6V8

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

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Type number	Package	Package description	Total product weight
BZB784-C6V8	SOT323	SC-70	5.55372 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934056307115	12	1	260		1	235			Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.14000	100.00000	2.52083
		subTotal		0.14000	100.00000	2.52083

Lead Frame	Iron-nickel alloy	Aluminium (Al)	7429-90-5	0.00162	0.09000	0.02917
		Carbon (C)	7440-44-0	0.00072	0.04000	0.01296
		Chromium (Cr)	7440-47-3	0.00378	0.21000	0.06806
		Cobalt (Co)	7440-48-4	0.00756	0.42000	0.13612
		Iron (Fe)	7439-89-6	0.84906	47.17000	15.28813
		Manganese (Mn)	7439-96-5	0.01530	0.85000	0.27549
		Nickel (Ni)	7440-02-0	0.63972	35.54000	11.51877
		Phosphorus (P)	7723-14-0	0.00036	0.02000	0.00648
		Silicon (Si)	7440-21-3	0.00450	0.25000	0.08103
		Sulphur (S)	7704-34-9	0.00036	0.02000	0.00648
	Pure metal layer	Copper (Cu)	7440-50-8	0.23490	13.05000	4.22960
		Silver (Ag)	7440-22-4	0.04212	2.34000	0.75841
		subTotal		1.80000	100.00000	32.41070

Mould Compound	Filler	Silica fused	60676-86-0	2.55340	75.10000	45.97639
	Pigment	Carbon black	1333-86-4	0.01020	0.30000	0.18366
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	0.59500	17.50000	10.71354
		Phenol Formaldehyde resin (generic)	9003-35-4	0.24140	7.10000	4.34664
		subTotal		3.40000	100.00000	61.22023

Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.00001	0.00300	0.00011
		Bismuth (Bi)	7440-69-9	0.00000	0.00100	0.00004
		Copper (Cu)	7440-50-8	0.00000	0.00100	0.00004
		Lead (Pb)	7439-92-1	0.00001	0.00500	0.00019
	Tin solder	Tin (Sn)	7440-31-5	0.20998	99.99000	3.78087
		subTotal		0.21000	100.00000	3.78125

Wire	Pure metal	Copper (Cu)	7440-50-8	0.00372	100.00000	0.06707
		subTotal		0.00372	100.00000	0.06707

		total		5.55372	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.