Chemical content BZB84-B3V0

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Type numberPackagePackage descriptionTotal product weight
BZB84-B3V0SOT23TO-236AB7.78426 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934061703215912601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.08000100.000001.02771
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002350.080000.03021
Carbon (C)7440-44-00.001180.040000.01511
Chromium (Cr)7440-47-30.006170.210000.07931
Cobalt (Co)7440-48-40.012350.420000.15863
Iron (Fe)7439-89-61.3818047.0000017.75121
Manganese (Mn)7439-96-50.024700.840000.31726
Nickel (Ni)7440-02-01.0410535.4100013.37383
Phosphorus (P)7723-14-00.000590.020000.00755
Silicon (Si)7440-21-30.007350.250000.09442
Sulphur (S)7704-34-90.000590.020000.00755
Pure metal layerCopper (Cu)7440-50-80.3822013.000004.90991
Silver (Ag)7440-22-40.079672.710001.02353
Mould CompoundAdditiveNon hazardousProprietary0.132472.900001.70179
FillerSilica -amorphous-7631-86-93.2889672.0000042.25142
PigmentCarbon black1333-86-40.002280.050000.02934
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.6852015.000008.80238
Phenol Formaldehyde resin (generic)9003-35-40.4568010.000005.86825
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000110.055500.00135
Tin solderTin (Sn)7440-31-50.1898999.940002.43936
WirePure metalCopper (Cu)7440-50-80.00626100.000000.08039
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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