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Chemical content BZT52H-B18-Q

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Type numberPackagePackage descriptionTotal product weight
BZT52H-B18-QSOD123FSOD29.79690 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934664242115212601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04800100.000000.48995
subTotal0.04800100.000000.48995
Lead FrameCopper alloyCopper (Cu)7440-50-82.8091796.8680028.67409
Iron (Fe)7439-89-60.061772.130000.63051
Phosphorus (P)7723-14-00.000870.030000.00888
Zinc (Zn)7440-66-60.003770.130000.03848
MetallisationSilver (Ag)7440-22-40.031611.090000.32265
Pure metal layerSilver (Ag)7440-22-40.023780.820000.24273
subTotal2.90000100.0000029.91734
Mould CompoundFillerSilica fused60676-86-04.7712071.0000048.70112
PigmentCarbon black1333-86-40.020160.300000.20578
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.3238419.7000013.51285
Phenolic resinProprietary0.604809.000006.17338
subTotal6.72000100.0000068.59313
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00006
Non hazardousProprietary0.000070.055500.00068
Tin solderTin (Sn)7440-31-50.1199399.940001.22414
subTotal0.12000100.000001.22488
WirePure metalGold (Au)7440-57-50.00890100.000000.09081
subTotal0.00890100.000000.09081
total9.79690100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.