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Chemical content BZV55-B27

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Type numberPackagePackage descriptionTotal product weight
BZV55-B27SOD80CLLDS0.63000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9339317901151212601235Shanwei, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.0152750.900002.42381
Pure metal layerSilver (Ag)7440-22-40.0147349.100002.33810
subTotal0.03000100.000004.76191
Post-PlatingImpurityAntimony (Sb)7440-36-00.000040.006000.00571
Bismuth (Bi)7440-69-90.000030.005000.00476
Lead (Pb)7439-92-10.000020.004000.00381
Pure metal layerTin (Sn)7440-31-50.5999199.9850095.22381
subTotal0.60000100.0000095.23809
total0.63000100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.