×

Chemical content BZX8450-C10-Q

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX8450-C10-QSOT23TO-236AB7.66469 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663300215212601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
934663300235212601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04800100.000000.62625
subTotal0.04800100.000000.62625
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002290.090000.02993
Carbon (C)7440-44-00.001020.040000.01330
Chromium (Cr)7440-47-30.005610.220000.07316
Cobalt (Co)7440-48-40.010960.430000.14300
Iron (Fe)7439-89-61.2230147.9800015.95642
Manganese (Mn)7439-96-50.021920.860000.28601
Nickel (Ni)7440-02-00.9212136.1400012.01886
Phosphorus (P)7723-14-00.000510.020000.00665
Silicon (Si)7440-21-30.006630.260000.08647
Sulphur (S)7704-34-90.000510.020000.00665
Pure metal layerCopper (Cu)7440-50-80.2898211.370003.78125
Silver (Ag)7440-22-40.065512.570000.85469
subTotal2.54900100.0000033.25639
Mould CompoundAdditiveNon hazardousProprietary0.141492.900001.84601
Triphenylphosphine603-35-00.002440.050000.03183
FillerSilica -amorphous-7631-86-93.5128872.0000045.83199
PigmentCarbon black1333-86-40.002440.050000.03183
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7318515.000009.54833
Phenol Formaldehyde resin (generic)9003-35-40.4879010.000006.36555
subTotal4.87900100.0000063.65554
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000100.055500.00134
Tin solderTin (Sn)7440-31-50.1848999.940002.41222
subTotal0.18500100.000002.41367
WirePure metalCopper (Cu)7440-50-80.00369100.000000.04811
subTotal0.00369100.000000.04811
total7.66469100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.