×

Chemical content BZX84W-B18

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BZX84W-B18SOT323SC-705.82679 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934660401115112601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
934660401135112601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.40000100.000006.86484
subTotal0.40000100.000006.86484
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.02848
Carbon (C)7440-44-00.000740.040000.01266
Chromium (Cr)7440-47-30.001660.090000.02848
Cobalt (Co)7440-48-40.007930.430000.13608
Iron (Fe)7439-89-60.8196644.4500014.06706
Manganese (Mn)7439-96-50.012720.690000.21836
Nickel (Ni)7440-02-00.6341534.3900010.88338
Phosphorus (P)7723-14-00.000370.020000.00633
Silicon (Si)7440-21-30.004790.260000.08228
Sulphur (S)7704-34-90.000370.020000.00633
Pure metal layerCopper (Cu)7440-50-80.3203017.370005.49707
Silver (Ag)7440-22-40.039652.150000.68041
subTotal1.84400100.0000031.64692
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.67725
Triphenylphosphine603-35-00.001680.050000.02892
FillerSilica -amorphous-7631-86-92.4264072.0000041.64214
PigmentCarbon black1333-86-40.001680.050000.02892
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000008.67545
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000005.78363
subTotal3.37000100.0000057.83631
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00018
Tin solderTin (Sn)7440-31-50.2099899.990003.60368
subTotal0.21000100.000003.60405
WirePure metalCopper (Cu)7440-50-80.00279100.000000.04795
subTotal0.00279100.000000.04795
total5.82679100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.