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Chemical content BZX884S-B3V3-Q

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Type numberPackagePackage descriptionTotal product weight
BZX884S-B3V3-QSOD882BDDFN1006-20.89300 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662920315112601235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.61702
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22277
Phenolic resinProprietary0.0025713.530000.28787
subTotal0.01900100.000002.12766
DieDoped siliconSilicon (Si)7440-21-30.02800100.000003.13550
subTotal0.02800100.000003.13550
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.28667
Magnesium (Mg)7439-95-40.000590.150000.06635
Nickel (Ni)7440-02-00.011772.980001.31814
Silicon (Si)7440-21-30.002570.650000.28751
Pure metal layerGold (Au)7440-57-50.000040.010000.00442
Nickel (Ni)7440-02-00.002250.570000.25213
Palladium (Pd)7440-05-30.000160.040000.01769
subTotal0.39500100.0000044.23291
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.78000
Silica fused60676-86-00.3387980.0920037.93832
PigmentCarbon black1333-86-40.003930.928000.43958
PolymerEpoxy resin systemProprietary0.035748.450004.00263
Phenolic resinProprietary0.010792.550001.20789
subTotal0.42300100.0000047.36842
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00124
Tin solderTin (Sn)7440-31-50.0199999.940002.23830
subTotal0.02000100.000002.23964
WireImpurityNon hazardousProprietary0.000000.010000.00009
Pure metalGold (Au)7440-57-50.0080099.990000.89577
subTotal0.00800100.000000.89586
total0.89300100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.