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Chemical content BZX8850S-C7V5-Q

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Type numberPackagePackage descriptionTotal product weight
BZX8850S-C7V5-QSOD882BDDFN1006-20.89656 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934663398315212601235Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0144476.000001.61060
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0019910.470000.22188
Phenolic resinProprietary0.0025713.530000.28673
subTotal0.01900100.000002.11921
DieDoped siliconSilicon (Si)7440-21-30.03500100.000003.90381
subTotal0.03500100.000003.90381
Lead FrameCopper alloyCopper (Cu)7440-50-80.3776295.6000042.11877
Magnesium (Mg)7439-95-40.000590.150000.06609
Nickel (Ni)7440-02-00.011772.980001.31291
Silicon (Si)7440-21-30.002570.650000.28637
Pure metal layerGold (Au)7440-57-50.000040.010000.00441
Nickel (Ni)7440-02-00.002250.570000.25113
Palladium (Pd)7440-05-30.000160.040000.01762
subTotal0.39500100.0000044.05730
Mould CompoundFillerSilica -amorphous-7631-86-90.033767.980003.76499
Silica fused60676-86-00.3387980.0920037.78767
PigmentCarbon black1333-86-40.003930.928000.43783
PolymerEpoxy resin systemProprietary0.035748.450003.98674
Phenolic resinProprietary0.010792.550001.20310
subTotal0.42300100.0000047.18033
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00010
Non hazardousProprietary0.000010.055500.00124
Tin solderTin (Sn)7440-31-50.0199999.940002.22941
subTotal0.02000100.000002.23075
WireImpurityNon hazardousProprietary0.000000.010000.00005
Pure metalGold (Au)7440-57-50.0045699.990000.50856
subTotal0.00456100.000000.50861
total0.89656100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.