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Chemical content CBT3257ABQ

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Type numberPackagePackage descriptionTotal product weight
CBT3257ABQSOT763-1DHVQFN1621.89582 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352856091151912601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0648880.100000.29632
PolymerResin systemProprietary0.0161219.900000.07362
subTotal0.08100100.000000.36994
DieDoped siliconSilicon (Si)7440-21-30.21479100.000000.98097
subTotal0.21479100.000000.98097
Lead FrameCopper alloyCopper (Cu)7440-50-89.8204196.0995044.85061
Iron (Fe)7439-89-60.237082.320001.08277
Lead (Pb)7439-92-10.000050.000500.00023
Phosphorus (P)7723-14-00.008180.080000.03734
Zinc (Zn)7440-66-60.012260.120000.05601
Gold alloyGold (Au)7440-57-50.003060.029970.01399
Silver (Ag)7440-22-40.002040.019980.00932
ImpurityNon hazardousProprietary0.000130.001280.00060
Pure metal layerCopper (Cu)7440-50-80.005100.049950.02331
Nickel (Ni)7440-02-00.130671.278720.59679
subTotal10.21900100.0000046.67097
Mould CompoundAdditiveNon hazardousProprietary0.329352.910001.50419
FillerSilica -amorphous-7631-86-90.395003.490001.80399
Silica fused60676-86-09.5999384.8200043.84365
PigmentCarbon black1333-86-40.018110.160000.08270
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.122231.080000.55825
Epoxy resin systemProprietary0.179961.590000.82187
Phenolic resinProprietary0.254662.250001.16303
Tetramethylbiphenyl diglycidyl ether85954-11-60.418773.700001.91254
subTotal11.31800100.0000051.69022
WirePure metalCopper (Cu)7440-50-80.0608596.550000.27792
Pure metal layerGold (Au)7440-57-50.000220.350000.00101
Palladium (Pd)7440-05-30.001953.100000.00892
subTotal0.06303100.000000.28785
total21.89582100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.