×

Chemical content CBTD3306GT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
CBTD3306GTSOT833-1XSON82.48044 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352914211151212601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07570100.000003.05195
subTotal0.07570100.000003.05195
ComponentAdditiveNon hazardousProprietary0.000755.000000.03024
FillerBisphenol A-epichlorohydrin resin25068-38-60.000755.000000.03024
Silica -amorphous-7631-86-90.0075050.000000.30237
PolymerEpoxy resin systemProprietary0.0045030.000000.18142
Phenol Formaldehyde resin (generic)9003-35-40.0015010.000000.06047
subTotal0.01500100.000000.60474
Lead FrameCopper alloyCopper (Cu)7440-50-80.9839493.4419039.66809
Magnesium (Mg)7439-95-40.001530.145700.06185
Nickel (Ni)7440-02-00.030682.914001.23706
Silicon (Si)7440-21-30.006650.631400.26804
Pure metal layerGold (Au)7440-57-50.000370.035000.01486
Nickel (Ni)7440-02-00.028562.712001.15130
Palladium (Pd)7440-05-30.001260.120000.05094
subTotal1.05300100.0000042.45214
Mould CompoundAdditiveNon hazardousProprietary0.005340.410000.21521
FillerSilica -amorphous-7631-86-90.003780.290000.15222
Silica fused60676-86-01.1216786.1500045.22073
HardenerPhenolic resinProprietary0.055864.290002.25185
PigmentCarbon black1333-86-40.002470.190000.09973
PolymerEpoxy resin systemProprietary0.112888.670004.55094
subTotal1.30200100.0000052.49068
WireGold alloyGold (Au)7440-57-50.0343999.000001.38635
Palladium (Pd)7440-05-30.000351.000000.01400
subTotal0.03474100.000001.40035
total2.48044100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.