Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content GAN111-650WSB

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC OPN Type No. Package State MSL
934666222127GAN111-650WSBQGAN111-650WSBSOT429-3 (TO-247)RFSNone
REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
CN RoHSCompliant with Chinese Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP; CN RoHS).
ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 217 ppm; substance 1333-86-4: 1112 ppm;
IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 216 ppm; substance 1333-86-4: 1111 ppm;
Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 1803 ppm;
RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
Solder WireTin alloyTin (Sn)7440-31-512.12250065.0000000.196768
Solder WireTin alloySilver (Ag)7440-22-44.66250025.0000000.075680
Solder WireTin alloyAntimony (Sb)7440-36-01.86500010.0000000.030271
Solder Wire Total18.650000100.0000000.302719
AdhesiveFillerSilver (Ag)7440-22-46.44490077.0000000.104611
AdhesivePolymerResin system1.92510023.0000000.031247
Adhesive Total8.370000100.0000000.135858
Die 1Doped siliconSilicon (Si)7440-21-37.21280098.0000000.117076
Die 1MetallisationGallium nitride (GaN)25617-97-40.1472002.0000000.002389
Die Total7.360000100.0000000.119465
Die 1 Total7.360000100.0000000.119465
Die 2Doped siliconSilicon (Si)7440-21-30.559200100.0000000.009077
Die Total0.559200100.0000000.009077
Die 2 Total0.559200100.0000000.009077
Lead FrameCopper alloyCopper (Cu)7440-50-84832.25600099.84000078.435220
Lead FrameCopper alloyIron (Fe)7439-89-64.8400000.1000000.078561
Lead FrameCopper alloyPhosphorus (P)7723-14-01.5730000.0325000.025532
Base Alloy Total4838.66900099.97250078.539313
Lead FramePure metal layerNickel (Ni)7440-02-01.3310000.0275000.021604
Pre-Plating Total1.3310000.0275000.021604
Lead Frame Total4840.000000100.00000078.560917
Mould CompoundFillerSilica fused60676-86-0920.54055073.93900014.941841
Mould CompoundPolymerEpoxy resin system186.75000015.0000003.031250
Mould CompoundFlame retardantAluminium hydroxide (Al(OH)3)21645-51-293.3750007.5000001.515625
Mould CompoundHardenerPhenolic resin37.3500003.0000000.606250
Mould CompoundPigmentCarbon black1333-86-46.8475000.5500000.111146
Mould CompoundImpurityNon-declarable0.1369500.0110000.002223
Mould Compound Total1245.000000100.00000020.208335
Post-PlatingTin solderTin (Sn)7440-31-538.66965299.9991000.627670
Post-PlatingImpurityNon-declarable0.0003480.0009000.000006
Post-Plating Total38.670000100.0000000.627676
Wire 3Pure metalAluminium (Al)7429-90-51.116484100.0000000.018122
Wire Total1.116484100.0000000.018122
Wire 3 Total1.116484100.0000000.018122
Wire 2Pure metalAluminium (Al)7429-90-50.87179799.9900000.014151
Wire 2ImpurityNon-declarable0.0000870.0100000.000001
Wire Total0.871884100.0000000.014152
Wire 2 Total0.871884100.0000000.014152
Wire 1Pure metalAluminium (Al)7429-90-50.22661499.9900000.003679
Wire 1ImpurityNon-declarable0.0000230.0100000.000000
Wire Total0.226637100.0000000.003679
Wire 1 Total0.226637100.0000000.003679
GAN111-650WSB Total6160.824205100.000000100.000000
Notes
Report created on 2024-12-01 19:33:28 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
部件名称
Material
有毒或有害物质和元素 (Toxic or hazardous substances and elements)
铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
焊锡丝 (Solder Wire)
胶黏剂 (Adhesive)
半导体芯片 (Die)
半导体芯片 (Die)
基底合金 (Base Alloy)
预镀层 (Pre-Plating)
模封料 (Mould Compound)
后镀层 (Post-Plating)
导线 (Wire)
导线 (Wire)
导线 (Wire)
表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
  该半导体产品具有无限期的环保使用期限(EFUP)。
This semiconductor product has an indefinite environmental friendly use period (EFUP).
Notes
Report created on 2024-12-01 19:33:28 CET+0100
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.