×

Chemical content HEF40106BTT-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
HEF40106BTT-Q100SOT402-1TSSOP1459.69634 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935299243118912601235Suzhou, China; Bangkok, Thailand; Jiangyin, China; Nijmegen, Netherlands; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.02610
PolymerAcrylic resinProprietary0.0030415.200000.00509
Resin systemProprietary0.001386.900000.00231
subTotal0.02000100.000000.03350
DieDoped siliconSilicon (Si)7440-21-30.23087100.000000.38674
subTotal0.23087100.000000.38674
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-818.7809297.4700031.46075
Iron (Fe)7439-89-60.462442.400000.77466
Phosphorus (P)7723-14-00.005780.030000.00968
Zinc (Zn)7440-66-60.019270.100000.03228
subTotal19.26841100.0000032.27737
Mould CompoundAdditiveNon hazardousProprietary1.861204.700003.11778
FillerSilica fused60676-86-031.2840079.0000052.40522
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.376006.000003.98014
PigmentCarbon black1333-86-40.079200.200000.13267
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-61.584004.000002.65343
Non hazardousProprietary1.623604.100002.71976
Tetramethylbiphenyl diglycidyl ether85954-11-60.792002.000001.32671
subTotal39.60000100.0000066.33571
Pre-PlatingPure metal layerGold (Au)7440-57-50.014673.000000.02458
Nickel (Ni)7440-02-00.4514692.300000.75626
Palladium (Pd)7440-05-30.015163.100000.02540
Silver (Ag)7440-22-40.007831.600000.01311
subTotal0.48912100.000000.81935
WirePure metalCopper (Cu)7440-50-80.08794100.000000.14732
subTotal0.08794100.000000.14732
total59.69634100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.