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Chemical content HEF4051BT-Q100

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Type numberPackagePackage descriptionTotal product weight
HEF4051BT-Q100SOT109-1SO16162.75664 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9352985191391112601235Bangkok, Thailand; Shanghai, China; Nijmegen, Netherlands; Suzhou, China; Jiangyin, China 
9352985191181012601235Jiangyin, China; Nijmegen, Netherlands; Shanghai, China; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0155877.900000.00957
PolymerAcrylic resinProprietary0.0030415.200000.00187
Resin systemProprietary0.001386.900000.00085
subTotal0.02000100.000000.01229
DieDoped siliconSilicon (Si)7440-21-30.92384100.000000.56762
subTotal0.92384100.000000.56762
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-854.6301297.4700033.56553
Iron (Fe)7439-89-61.345162.400000.82648
Phosphorus (P)7723-14-00.016810.030000.01033
Zinc (Zn)7440-66-60.056050.100000.03444
subTotal56.04814100.0000034.43678
Mould CompoundAdditiveNon hazardousProprietary4.899614.700003.01039
FillerSilica fused60676-86-082.3551379.0000050.60017
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-86.254826.000003.84305
PigmentCarbon black1333-86-40.208490.200000.12810
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-64.169884.000002.56203
Non hazardousProprietary4.274134.100002.62608
Tetramethylbiphenyl diglycidyl ether85954-11-62.084942.000001.28102
subTotal104.24700100.0000064.05084
Pre-PlatingPure metal layerGold (Au)7440-57-50.042683.000000.02622
Nickel (Ni)7440-02-01.3132192.300000.80685
Palladium (Pd)7440-05-30.044113.100000.02710
Silver (Ag)7440-22-40.022761.600000.01399
subTotal1.42276100.000000.87416
WirePure metalCopper (Cu)7440-50-80.09489100.000000.05830
subTotal0.09489100.000000.05830
total162.75664100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.