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Chemical content HEF4069UBT-Q100

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Type numberPackagePackage descriptionTotal product weight
HEF4069UBT-Q100SOT108-1SO14141.63691 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935300108139912601235Jiangyin, China; Shanghai, China; Bangkok, Thailand; Suzhou, China; Nijmegen, Netherlands 
935300108118912601235Jiangyin, China; Shanghai, China; Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0233777.900000.01650
PolymerAcrylic resinProprietary0.0045615.200000.00322
Resin systemProprietary0.002076.900000.00146
subTotal0.03000100.000000.02118
DieDoped siliconSilicon (Si)7440-21-30.21698100.000000.15320
subTotal0.21698100.000000.15320
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-847.7480497.4700033.71158
Iron (Fe)7439-89-61.175702.400000.83008
Phosphorus (P)7723-14-00.014700.030000.01038
Zinc (Zn)7440-66-60.048990.100000.03459
subTotal48.98742100.0000034.58663
Mould CompoundAdditiveNon hazardousProprietary4.280974.700003.02250
FillerSilica fused60676-86-071.9567679.0000050.80367
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-85.465076.000003.85851
PigmentCarbon black1333-86-40.182170.200000.12862
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.643384.000002.57234
Non hazardousProprietary3.734464.100002.63665
Tetramethylbiphenyl diglycidyl ether85954-11-61.821692.000001.28617
subTotal91.08450100.0000064.30846
Pre-PlatingPure metal layerGold (Au)7440-57-50.037313.000000.02634
Nickel (Ni)7440-02-01.1477892.300000.81037
Palladium (Pd)7440-05-30.038553.100000.02722
Silver (Ag)7440-22-40.019901.600000.01405
subTotal1.24353100.000000.87798
WirePure metalCopper (Cu)7440-50-80.07448100.000000.05259
subTotal0.07448100.000000.05259
total141.63691100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.