Chemical content HEF4094BTT-Q100

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Type numberPackagePackage descriptionTotal product weight
HEF4094BTT-Q100SOT403-1TSSOP1660.62049 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9353020941181112601235Suzhou, China; Shanghai, China; Bangkok, Thailand; Nijmegen, Netherlands; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21846
PolymerAcrylic resinProprietary0.0258415.200000.04263
Resin systemProprietary0.011736.900000.01935
DieDoped siliconSilicon (Si)7440-21-30.44746100.000000.73814
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.85915
Iron (Fe)7439-89-60.475552.400000.78447
Phosphorus (P)7723-14-00.005940.030000.00981
Zinc (Zn)7440-66-60.019810.100000.03269
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39195
Silica fused60676-86-031.0186878.3300051.16864
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.98479
PigmentCarbon black1333-86-40.079200.200000.13065
PolymerEpoxy resin systemProprietary3.509358.862005.78905
Phenolic resinProprietary2.339575.908003.85937
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02489
Nickel (Ni)7440-02-00.4642592.300000.76583
Palladium (Pd)7440-05-30.015593.100000.02572
Silver (Ag)7440-22-40.008051.600000.01328
WirePure metalCopper (Cu)7440-50-80.08557100.000000.14116
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.