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Chemical content HEF4518BT

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Type numberPackagePackage descriptionTotal product weight
HEF4518BTSOT109-1SO16143.27359 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9333732306531312601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.39768
PolymerResin systemProprietary0.4975019.900000.34724
subTotal2.50000100.000001.74492
DieDoped siliconSilicon (Si)7440-21-31.37334100.000000.95854
subTotal1.37334100.000000.95854
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.30178
Iron (Fe)7439-89-61.704002.400001.18933
Phosphorus (P)7723-14-00.021300.030000.01487
Zinc (Zn)7440-66-60.071000.100000.04956
subTotal71.00000100.0000049.55554
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.23070
FillerSilica fused60676-86-053.7200079.0000037.49470
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.84770
PigmentCarbon black1333-86-40.136000.200000.09492
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.89847
Non hazardousProprietary2.788004.100001.94593
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.94923
subTotal68.00000100.0000047.46165
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00209
Nickel (Ni)7440-02-00.2910097.000000.20311
Palladium (Pd)7440-05-30.006002.000000.00419
subTotal0.30000100.000000.20939
WirePure metalCopper (Cu)7440-50-80.10024100.000000.06997
subTotal0.10024100.000000.06997
total143.27359100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.