Chemical content HEF4518BT

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
HEF4518BTSOT109-1SO16143.27359 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9333732306531312601235Nijmegen, Netherlands; Bangkok, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.39768
PolymerResin systemProprietary0.4975019.900000.34724
DieDoped siliconSilicon (Si)7440-21-31.37334100.000000.95854
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.30178
Iron (Fe)7439-89-61.704002.400001.18933
Phosphorus (P)7723-14-00.021300.030000.01487
Zinc (Zn)7440-66-60.071000.100000.04956
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.23070
FillerSilica fused60676-86-053.7200079.0000037.49470
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.84770
PigmentCarbon black1333-86-40.136000.200000.09492
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.89847
Non hazardousProprietary2.788004.100001.94593
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.94923
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00209
Nickel (Ni)7440-02-00.2910097.000000.20311
Palladium (Pd)7440-05-30.006002.000000.00419
WirePure metalCopper (Cu)7440-50-80.10024100.000000.06997
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.