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Chemical content IP4234CZ6

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Type numberPackagePackage descriptionTotal product weight
IP4234CZ6SOT457SC-7410.68000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934063369125912601235D-22529 HAMBURG, Germany; Seremban, Malaysia 
9340633691151012601235D-22529 HAMBURG, Germany; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0150075.000000.14045
PolymerResin systemProprietary0.0050025.000000.04682
subTotal0.02000100.000000.18727
DieDoped siliconSilicon (Si)7440-21-30.16000100.000001.49813
subTotal0.16000100.000001.49813
Lead FrameCopper alloyCopper (Cu)7440-50-83.3491597.0768031.35908
Iron (Fe)7439-89-60.074182.150000.69452
Phosphorus (P)7723-14-00.000520.015200.00491
Zinc (Zn)7440-66-60.002000.058000.01874
Pure metal layerSilver (Ag)7440-22-40.024150.700000.22612
subTotal3.45000100.0000032.30337
Mould CompoundFillerSilica fused60676-86-04.6292071.0000043.34457
PigmentCarbon black1333-86-40.019560.300000.18315
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2844419.7000012.02659
Phenolic resinProprietary0.586809.000005.49438
subTotal6.52000100.0000061.04869
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.003000.00015
Bismuth (Bi)7440-69-90.000010.001000.00005
Copper (Cu)7440-50-80.000010.001000.00005
Lead (Pb)7439-92-10.000030.005000.00024
Tin solderTin (Sn)7440-31-50.5199599.990004.86843
subTotal0.52000100.000004.86892
WireGold alloyGold (Au)7440-57-50.0049599.000000.04635
Palladium (Pd)7440-05-30.000051.000000.00047
subTotal0.00500100.000000.04682
total10.68000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.