×

Chemical content LSF0101GM

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
LSF0101GMSOT886XSON61.93003 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690956115412601235Bangkok, Thailand; Seremban, Malaysia; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.07428100.000003.84861
subTotal0.07428100.000003.84861
ComponentAdditiveNon hazardousProprietary0.000255.000000.01295
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.01295
Silica -amorphous-7631-86-90.0025050.000000.12953
PolymerEpoxy resin systemProprietary0.0015030.000000.07772
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.02591
subTotal0.00500100.000000.25906
Lead FrameCopper alloyCopper (Cu)7440-50-80.7296294.5100037.80341
Magnesium (Mg)7439-95-40.001160.150000.06000
Nickel (Ni)7440-02-00.022772.950001.17998
Silicon (Si)7440-21-30.004940.640000.25600
Pure metal layerGold (Au)7440-57-50.000150.020000.00800
Nickel (Ni)7440-02-00.012661.640000.65599
Palladium (Pd)7440-05-30.000690.090000.03600
subTotal0.77200100.0000039.99938
Mould CompoundAdditiveNon hazardousProprietary0.004370.410000.22624
FillerSilica -amorphous-7631-86-90.003090.290000.16002
Silica fused60676-86-00.9175086.1500047.53799
HardenerPhenolic resinProprietary0.045694.290002.36724
PigmentCarbon black1333-86-40.002020.190000.10484
PolymerEpoxy resin systemProprietary0.092348.670004.78415
subTotal1.06500100.0000055.18048
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalCopper (Cu)7440-50-80.0132796.490000.68738
Pure metal layerGold (Au)7440-57-50.000070.500000.00356
Palladium (Pd)7440-05-30.000413.000000.02137
subTotal0.01375100.000000.71238
total1.93003100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.