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Chemical content LSF0102GX

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Type numberPackagePackage descriptionTotal product weight
LSF0102GXSOT1233-2X2SON81.05267 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935690294115812601235Seremban, Malaysia; Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China; Shanghai, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04552100.000004.32414
subTotal0.04552100.000004.32414
ComponentAdditiveNon hazardousProprietary0.000255.000000.02375
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.02375
Silica -amorphous-7631-86-90.0025050.000000.23749
PolymerEpoxy resin systemProprietary0.0015030.000000.14249
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.04750
subTotal0.00500100.000000.47498
Lead FrameCopper alloyCopper (Cu)7440-50-80.3865594.5100036.72052
Magnesium (Mg)7439-95-40.000610.150000.05828
Nickel (Ni)7440-02-00.012072.950001.14618
Silicon (Si)7440-21-30.002620.640000.24866
Pure metal layerGold (Au)7440-57-50.000080.020000.00777
Nickel (Ni)7440-02-00.006711.640000.63720
Palladium (Pd)7440-05-30.000370.090000.03497
subTotal0.40900100.0000038.85358
Mould CompoundAdditiveNon hazardousProprietary0.002300.410000.21889
FillerSilica -amorphous-7631-86-90.001630.290000.15483
Silica fused60676-86-00.4841686.1500045.99381
HardenerPhenolic resinProprietary0.024114.290002.29035
PigmentCarbon black1333-86-40.001070.190000.10144
PolymerEpoxy resin systemProprietary0.048738.670004.62874
subTotal0.56200100.0000053.38806
WireGold alloyGold (Au)7440-57-50.0308499.000002.92955
Palladium (Pd)7440-05-30.000311.000000.02959
subTotal0.03115100.000002.95914
total1.05267100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.