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Chemical content MJD41C-Q

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Type numberPackagePackage descriptionTotal product weight
MJD41C-QSOT428CDPAK316.60313 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662843118312601235D-22529 HAMBURG, Germany; Nantong, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.81000100.000000.25584
subTotal0.81000100.000000.25584
Lead FrameCopper alloyCopper (Cu)7440-50-8173.9541599.8646054.94391
Tin (Sn)7440-31-50.231670.133000.07317
Pure metal layerNickel (Ni)7440-02-00.004180.002400.00132
subTotal174.19000100.0000055.01840
Mould CompoundFillerSilica fused60676-86-0121.4167588.9500038.34983
PigmentCarbon black1333-86-40.750750.550000.23713
PolymerEpoxy resin systemProprietary10.237507.500003.23354
Phenolic resinProprietary4.095003.000001.29342
subTotal136.50000100.0000043.11392
Post-PlatingImpurityNon hazardousProprietary0.000030.000900.00001
Tin solderTin (Sn)7440-31-53.2599799.999101.02967
subTotal3.26000100.000001.02968
Solder WireLead alloyLead (Pb)7439-92-11.7285595.500000.54597
Silver (Ag)7440-22-40.045252.500000.01429
Tin (Sn)7440-31-50.036202.000000.01143
subTotal1.81000100.000000.57169
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalAluminium (Al)7429-90-50.0331399.990000.01046
subTotal0.03313100.000000.01046
total316.60313100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.