Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content MMBZ15VDL

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
MMBZ15VDLSOT23TO-236AB7.930071 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
93406180921510126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.220000100.0000002.774250
subTotal0.220000100.0000002.774250
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0023520.0800000.029659
Carbon (C)7440-44-00.0011760.0400000.014830
Chromium (Cr)7440-47-30.0061740.2100000.077856
Cobalt (Co)7440-48-40.0123480.4200000.155711
Iron (Fe)7439-89-61.38180047.00000017.424812
Manganese (Mn)7439-96-50.0246960.8400000.311422
Nickel (Ni)7440-02-01.04105435.41000013.127928
Phosphorus (P)7723-14-00.0005880.0200000.007415
Silicon (Si)7440-21-30.0073500.2500000.092685
Sulphur (S)7704-34-90.0005880.0200000.007415
Pure metal layerCopper (Cu)7440-50-80.38220013.0000004.819629
Silver (Ag)7440-22-40.0796742.7100001.004707
subTotal2.940000100.00000037.074069
Mould CompoundAdditiveNon hazardousProprietary0.1324722.9000001.670502
Triphenylphosphine603-35-00.0022840.0500000.028802
FillerSilica -amorphous-7631-86-93.28896072.00000041.474534
PigmentCarbon black1333-86-40.0022840.0500000.028802
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.68520015.0000008.640528
Phenol Formaldehyde resin (generic)9003-35-40.45680010.0000005.760352
subTotal4.568000100.00000057.603520
Post-PlatingImpurityLead (Pb)7439-92-10.0000090.0045000.000108
Non hazardousProprietary0.0001050.0555000.001330
Tin solderTin (Sn)7440-31-50.18988699.9400002.394506
subTotal0.190000100.0000002.395943
WireImpurityNon hazardousProprietary0.0000010.0100000.000015
Pure metalCopper (Cu)7440-50-80.01207099.9900000.152205
subTotal0.012071100.0000000.152221
total7.930071100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.