Chemical content MMBZ18VCL-Q

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Type numberPackagePackage descriptionTotal product weight
MMBZ18VCL-QSOT23TO-236AB7.93038 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346655332151126030 s123520 s3Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.22000100.000002.77414
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002350.080000.02966
Carbon (C)7440-44-00.001180.040000.01483
Chromium (Cr)7440-47-30.006170.210000.07785
Cobalt (Co)7440-48-40.012350.420000.15571
Iron (Fe)7439-89-61.3818047.0000017.42413
Manganese (Mn)7439-96-50.024700.840000.31141
Nickel (Ni)7440-02-01.0410535.4100013.12742
Phosphorus (P)7723-14-00.000590.020000.00741
Silicon (Si)7440-21-30.007350.250000.09268
Sulphur (S)7704-34-90.000590.020000.00741
Pure metal layerCopper (Cu)7440-50-80.3822013.000004.81944
Silver (Ag)7440-22-40.079672.710001.00467
Mould CompoundAdditiveNon hazardousProprietary0.132472.900001.67044
FillerSilica -amorphous-7631-86-93.2889672.0000041.47292
PigmentCarbon black1333-86-40.002280.050000.02880
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.6852015.000008.64019
Phenol Formaldehyde resin (generic)9003-35-40.4568010.000005.76013
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000110.055500.00133
Tin solderTin (Sn)7440-31-50.1898999.940002.39441
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0123899.990000.15605
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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