×

Chemical content MMBZ27VA-T

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
MMBZ27VA-TSOT23TO-236AB7.83490 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661194215612601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10800100.000001.37845
subTotal0.10800100.000001.37845
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002350.080000.03002
Carbon (C)7440-44-00.001180.040000.01501
Chromium (Cr)7440-47-30.006170.210000.07880
Cobalt (Co)7440-48-40.012350.420000.15760
Iron (Fe)7439-89-61.3818047.0000017.63647
Manganese (Mn)7439-96-50.024700.840000.31521
Nickel (Ni)7440-02-01.0410535.4100013.28739
Phosphorus (P)7723-14-00.000590.020000.00750
Silicon (Si)7440-21-30.007350.250000.09381
Sulphur (S)7704-34-90.000590.020000.00750
Pure metal layerCopper (Cu)7440-50-80.3822013.000004.87817
Silver (Ag)7440-22-40.079672.710001.01691
subTotal2.94000100.0000037.52439
Mould CompoundAdditiveNon hazardousProprietary0.132472.900001.69079
Triphenylphosphine603-35-00.002280.050000.02915
FillerSilica -amorphous-7631-86-93.2889672.0000041.97833
PigmentCarbon black1333-86-40.002280.050000.02915
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.6852015.000008.74548
Phenol Formaldehyde resin (generic)9003-35-40.4568010.000005.83032
subTotal4.56800100.0000058.30322
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000110.055500.00135
Tin solderTin (Sn)7440-31-50.1898999.940002.42359
subTotal0.19000100.000002.42505
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0288799.990000.36851
subTotal0.02888100.000000.36855
total7.83490100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.