Chemical content NGFP15T65M3DFP

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934669562127	NGFP15T65M3DFPQ	NGFP15T65M3DFP	SOT404B-1 (TO220FP-3L)	RFS	None

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 5485 ppm of the article. SCIP No. is not yet available.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Not compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS).
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 429 ppm; substance 1333-86-4: 5327 ppm; substance 7439-92-1: 5485 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 429 ppm; substance 1333-86-4: 5327 ppm; substance 7439-92-1: 5485 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 120 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die 1	Doped silicon	Silicon (Si)	7440-21-3	2.805538	95.752180	0.181081
Die 1	Polymer	Non-declarable		0.022044	0.752340	0.001423
Die 1	Pure metal layer	Aluminium (Al)	7429-90-5	0.041621	1.420500	0.002686
		Die Metallization 1 Total		0.041621	1.420500	0.002686
Die 1	Pure metal layer	Nickel (Ni)	7440-02-0	0.009049	0.308830	0.000584
		Die Metallization 2 Total		0.009049	0.308830	0.000584
Die 1	Pure metal layer	Titanium (Ti)	7440-32-6	0.001850	0.063130	0.000119
		Die Metallization 3 Total		0.001850	0.063130	0.000119
Die 1	Pure metal layer	Silver (Ag)	7440-22-4	0.049898	1.703020	0.003221
		Die Metallization 4 Total		0.049898	1.703020	0.003221
		Die 1 Total		2.930000	100.000000	0.189114

Die 2	Doped silicon	Silicon (Si)	7440-21-3	7.810000	100.000000	0.504089
		Die 2 Total		7.810000	100.000000	0.504089

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	688.532075	99.715000	44.440648
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	1.035750	0.150000	0.066851
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	0.276200	0.040000	0.017827
		Base Alloy Total		689.844025	99.905000	44.525326
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.655975	0.095000	0.042339
		Pre-Plating Total		0.655975	0.095000	0.042339
		Lead Frame Total		690.500000	100.000000	44.567665

Mould Compound	Filler	Quartz (SiO2)	14808-60-7	643.812000	78.000000	41.554233
Mould Compound	Polymer	Formaldehyde-phenol copolymer	9003-35-4	41.270000	5.000000	2.663733
Mould Compound	Polymer	Phenol, polymer with 3a,4,7,7a-tetrahydro-4,7-methano-1H-indene, glycidyl ether	119345-05-0	41.270000	5.000000	2.663733
Mould Compound	Filler	Silica fused	60676-86-0	41.270000	5.000000	2.663733
Mould Compound	Polymer	o-Cresol-epichlorohydrin-formaldehyde copolymer	29690-82-2	41.270000	5.000000	2.663733
Mould Compound	Pigment	Carbon black	1333-86-4	8.254000	1.000000	0.532747
Mould Compound	Oxide Ceramics	Non-declarable		8.254000	1.000000	0.532746
		Mould Compound Total		825.400000	100.000000	53.274658

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	7.419258	99.990000	0.478869
Post-Plating	Impurity	Non-declarable		0.000742	0.010000	0.000048
		Post-Plating Total		7.420000	100.000000	0.478917

Wire 1	Pure metal	Aluminium (Al)	7429-90-5	6.059783	99.990000	0.391123
Wire 1	Impurity	Nickel (Ni)	7440-02-0	0.000364	0.006000	0.000023
Wire 1	Impurity	Magnesium (Mg)	7439-95-4	0.000061	0.001000	0.000004
Wire 1	Impurity	Silicon (Si)	7440-21-3	0.000061	0.001000	0.000004
Wire 1	Impurity	Copper (Cu)	7440-50-8	0.000060	0.001000	0.000004
Wire 1	Impurity	Iron (Fe)	7439-89-6	0.000060	0.001000	0.000004
		Wire 1 Total		6.060389	100.000000	0.391162

Wire 2	Pure metal	Aluminium (Al)	7429-90-5	0.119118	99.990000	0.007688
Wire 2	Impurity	Nickel (Ni)	7440-02-0	0.000007	0.006000	0.000001
Wire 2	Impurity	Iron (Fe)	7439-89-6	0.000002	0.001000	0.000000
Wire 2	Impurity	Copper (Cu)	7440-50-8	0.000001	0.001000	0.000000
Wire 2	Impurity	Magnesium (Mg)	7439-95-4	0.000001	0.001000	0.000000
Wire 2	Impurity	Silicon (Si)	7440-21-3	0.000001	0.001000	0.000000
		Wire 2 Total		0.119130	100.000000	0.007689

Chip Coat	Polymer	3-Aminopropyltrihydroxysilane	58160-99-9	0.000010	100.000000	0.000001
		Chip Coat Total		0.000010	100.000000	0.000001

Solder Wire	Lead alloy	Lead (Pb)	7439-92-1	8.499150	93.500000	0.548569
Solder Wire	Lead alloy	Tin (Sn)	7440-31-5	0.454500	5.000000	0.029335
Solder Wire	Lead alloy	Silver (Ag)	7440-22-4	0.136350	1.500000	0.008801
		Solder Wire Total		9.090000	100.000000	0.586705

		NGFP15T65M3DFP Total		1549.329529		100.000000

Notes
Report created on 2025-06-02 12:36:41 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层1 (Die Metallization 1)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层2 (Die Metallization 2)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层3 (Die Metallization 3)	◯	◯	◯	◯	◯	◯
半导体芯片金属化层4 (Die Metallization 4)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯
预镀层 (Pre-Plating)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
芯片涂层 (Chip Coat)	◯	◯	◯	◯	◯	◯
焊锡丝 (Solder Wire)	✕	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品具有无限期的环保使用期限（EFUP）。 This semiconductor product has an indefinite environmental friendly use period (EFUP).

Notes
Report created on 2025-06-02 12:36:41 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

All products

Bipolar transistors

Diodes

ESD protection, TVS, signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive

All applications

Automotive

Industrial and Power

Mobile and Wearables

Computing and Consumer

Sub-systems: Power conversion topologies

Sub-systems: General

Reference designs

Evaluation boards

Interactive application notes

Advanced Support Tools

Chemical content NGFP15T65M3DFP

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NGFP15T65M3DFP