Chemical content NGW40T65M3DFQ

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

12NC	OPN	Type No.	Package	State	MSL
934671223127	NGW40T65M3DFQQ	NGW40T65M3DFQ	SOT429-2 (TO247-3L)	RFS	None

REACH	Compliant with Regulation 1907/2006/EC (REACH). Contains REACH SVHC substance 7439-92-1 at 6561 ppm of the article. SCIP No. 72cff671-3be6-4935-9b41-015f709bf43a.
EU RoHS	Compliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended'); using exemption 7(a): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
CN RoHS	Compliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS); using exemption 8.1: '高熔点焊料 (如铅含量超过85%（重量百分比）的铅基合金焊料）'.
ELV	Compliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV); using exemption 8(e): 'Lead in high melting temperature type solders (i.e. lead-based alloys containing 85% by weight or more lead).'.
PFAS	Does not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
CA Proposition 65	Contains California Proposition 65 substance(s) [at the article level]: substance 7440-02-0: 135 ppm; substance 7439-92-1: 6561 ppm; substance 1333-86-4: 1747 ppm;
IEC 62474	Contains IEC 62474 substance(s) [at the article level]: substance 7440-02-0: 135 ppm; substance 7439-92-1: 6561 ppm; substance 1333-86-4: 1747 ppm;
Precious Metals	Contains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 125 ppm;
RHF Indicator	Contains EU RoHS-exempted lead and halogen-free according to Nexperia's halogen-free definition.

Material	Material Group	Substance	CAS No.	Mass (mg)	Material (%)	Product (%)
Die 1	Doped silicon	Silicon (Si)	7440-21-3	6.702653	95.752180	0.110508
Die 1	Pure metal layer	Silver (Ag)	7440-22-4	0.119211	1.703020	0.001966
Die 1	Pure metal	Aluminium (Al)	7429-90-5	0.099435	1.420500	0.001639
Die 1	Pure metal layer	Non-declarable		0.052664	0.752340	0.000868
Die 1	Pure metal layer	Nickel (Ni)	7440-02-0	0.021618	0.308830	0.000356
Die 1	Pure metal layer	Titanium (Ti)	7440-32-6	0.004419	0.063130	0.000073
		Die 1 Total		7.000000	100.000000	0.115410

Die 2	Doped silicon	Silicon (Si)	7440-21-3	2.609600	100.000000	0.043025
		Die 2 Total		2.609600	100.000000	0.043025

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	4034.591604	99.878490	66.518957
Lead Frame	Copper alloy	Iron (Fe)	7439-89-6	2.827650	0.070000	0.046620
Lead Frame	Copper alloy	Phosphorus (P)	7723-14-0	1.211850	0.030000	0.019980
Lead Frame	Impurity	Lead (Pb)	7439-92-1	0.060996	0.001510	0.001006
Lead Frame	Impurity	Non-declarable		0.008079	0.000200	0.000133
		Base Alloy C19210 Total		4038.700179	99.980200	66.586696
Lead Frame	Pure metal layer	Nickel (Ni)	7440-02-0	0.799821	0.019800	0.013187
		Pre-Plating Total		0.799821	0.019800	0.013187
		Lead Frame Total		4039.500000	100.000000	66.599883

Mould Compound	Filler	Silica fused	60676-86-0	1646.544595	85.450000	27.146844
Mould Compound	Polymer	Epoxy resin system		144.518250	7.500000	2.382696
Mould Compound	Additive	Non-declarable		57.807300	3.000000	0.953078
Mould Compound	Hardener	Phenolic resin		57.807300	3.000000	0.953078
Mould Compound	Pigment	Carbon black	1333-86-4	10.598005	0.550000	0.174731
Mould Compound	Additive	Non-declarable		9.634550	0.500000	0.158846
		Mould Compound Total		1926.910000	100.000000	31.769273

Post-Plating	Pure metal layer	Tin (Sn)	7440-31-5	29.527047	99.990000	0.486817
Post-Plating	Impurity	Non-declarable		0.002953	0.010000	0.000049
		Post-Plating Total		29.530000	100.000000	0.486866

Wire 1	Pure metal	Aluminium (Al)	7429-90-5	17.128818	99.990000	0.282405
Wire 1	Impurity	Nickel (Ni)	7440-02-0	0.001028	0.006000	0.000017
Wire 1	Impurity	Iron (Fe)	7439-89-6	0.000172	0.001000	0.000003
Wire 1	Impurity	Copper (Cu)	7440-50-8	0.000171	0.001000	0.000003
Wire 1	Impurity	Magnesium (Mg)	7439-95-4	0.000171	0.001000	0.000003
Wire 1	Impurity	Silicon (Si)	7440-21-3	0.000171	0.001000	0.000003
		Wire 1 Total		17.130531	100.000000	0.282434

Wire 2	Pure metal	Aluminium (Al)	7429-90-5	0.145832	99.990000	0.002405
Wire 2	Impurity	Nickel (Ni)	7440-02-0	0.000009	0.006000	0.000000
Wire 2	Impurity	Copper (Cu)	7440-50-8	0.000002	0.001000	0.000000
Wire 2	Impurity	Iron (Fe)	7439-89-6	0.000002	0.001000	0.000000
Wire 2	Impurity	Magnesium (Mg)	7439-95-4	0.000001	0.001000	0.000000
Wire 2	Impurity	Silicon (Si)	7440-21-3	0.000001	0.001000	0.000000
		Wire 2 Total		0.145847	100.000000	0.002405

Solder Wire	Lead alloy	Lead (Pb)	7439-92-1	39.737500	93.500000	0.655158
Solder Wire	Lead alloy	Tin (Sn)	7440-31-5	2.125000	5.000000	0.035035
Solder Wire	Lead alloy	Silver (Ag)	7440-22-4	0.637500	1.500000	0.010511
		Solder Wire Total		42.500000	100.000000	0.700704

		NGW40T65M3DFQ Total		6065.325978		100.000000

Notes
Report created on 2025-10-05 11:17:30 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

部件名称 Material	有毒或有害物质和元素 (Toxic or hazardous substances and elements)
部件名称 Material	铅 (Pb)	镉 (Cd)	汞 (Hg)	六价铬 (Cr⁶⁺)	多溴联苯 (PBB)	多溴二苯醚 (PBDE)
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
半导体芯片 (Die)	◯	◯	◯	◯	◯	◯
基底合金 (Base Alloy)	◯	◯	◯	◯	◯	◯
预镀层 (Pre-Plating)	◯	◯	◯	◯	◯	◯
模封料 (Mould Compound)	◯	◯	◯	◯	◯	◯
后镀层 (Post-Plating)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
导线 (Wire)	◯	◯	◯	◯	◯	◯
焊锡丝 (Solder Wire)	✕	◯	◯	◯	◯	◯

◯	表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下 Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
✕	表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求 Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
	该半导体产品的环保使用期限（EFUP）为50年。 This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

Notes
Report created on 2025-10-05 11:17:30 CEST+0200

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

Disclaimer

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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Chemical content NGW40T65M3DFQ

Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NGW40T65M3DFQ