×

Chemical content NHUMD10

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NHUMD10SOT363SC-885.47642 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661436135112601235D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
934661436115112601235D-22529 HAMBURG, Germany; Dongguan, China; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05400100.000000.98605
subTotal0.05400100.000000.98605
DieDoped siliconSilicon (Si)7440-21-30.05400100.000000.98605
subTotal0.05400100.000000.98605
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03402
Carbon (C)7440-44-00.000830.040000.01512
Chromium (Cr)7440-47-30.004350.210000.07938
Cobalt (Co)7440-48-40.008900.430000.16253
Iron (Fe)7439-89-60.9811847.4000017.91645
Manganese (Mn)7439-96-50.017600.850000.32129
Nickel (Ni)7440-02-00.7392035.7100013.49781
Phosphorus (P)7723-14-00.000410.020000.00756
Silicon (Si)7440-21-30.005380.260000.09828
Sulphur (S)7704-34-90.000410.020000.00756
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.95537
Silver (Ag)7440-22-40.038501.860000.70305
subTotal2.07000100.0000037.79842
Mould CompoundFillerSilica fused60676-86-02.1929275.1000040.04295
PigmentCarbon black1333-86-40.008760.300000.15996
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.33091
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.78568
subTotal2.92000100.0000053.31950
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.75556
subTotal0.37000100.000006.75624
WirePure metalCopper (Cu)7440-50-80.00842100.000000.15372
subTotal0.00842100.000000.15372
total5.47642100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.