×

Chemical content NHUMH1

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NHUMH1SOT363SC-885.47623 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661431135112351235Dongguan, China; D-22529 HAMBURG, Germany; Seremban, Malaysia 
934661431115112601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10800100.000001.97216
subTotal0.10800100.000001.97216
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03402
Carbon (C)7440-44-00.000830.040000.01512
Chromium (Cr)7440-47-30.004350.210000.07938
Cobalt (Co)7440-48-40.008900.430000.16254
Iron (Fe)7439-89-60.9811847.4000017.91707
Manganese (Mn)7439-96-50.017600.850000.32130
Nickel (Ni)7440-02-00.7392035.7100013.49828
Phosphorus (P)7723-14-00.000410.020000.00756
Silicon (Si)7440-21-30.005380.260000.09828
Sulphur (S)7704-34-90.000410.020000.00756
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.95554
Silver (Ag)7440-22-40.038501.860000.70307
subTotal2.07000100.0000037.79972
Mould CompoundFillerSilica fused60676-86-02.1929275.1000040.04434
PigmentCarbon black1333-86-40.008760.300000.15996
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.33124
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.78582
subTotal2.92000100.0000053.32136
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.75580
subTotal0.37000100.000006.75648
WirePure metalCopper (Cu)7440-50-80.00823100.000000.15033
subTotal0.00823100.000000.15033
total5.47623100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.