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Chemical content NX138AKM

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Type numberPackagePackage descriptionTotal product weight
NX138AKMSOT883XQFN30.84415 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662483315212601235Dongguan, China; Hsin-chu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.90031
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12403
Phenolic resinProprietary0.0013513.530000.16028
subTotal0.01000100.000001.18462
DieDoped siliconSilicon (Si)7440-21-30.01800100.000002.13232
subTotal0.01800100.000002.13232
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100047.58195
Magnesium (Mg)7439-95-40.000630.146000.07437
Nickel (Ni)7440-02-00.012532.913001.48385
Silicon (Si)7440-21-30.002710.631000.32142
MetallisationGold (Au)7440-57-50.000150.035000.01783
Nickel (Ni)7440-02-00.011852.755001.40336
Palladium (Pd)7440-05-30.000470.110000.05603
subTotal0.43000100.0000050.93881
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.0000010.08115
Silica fused60676-86-00.2220060.0000026.29864
Flame retardantMetal hydroxideProprietary0.011103.000001.31493
ImpurityBismuth (Bi)7440-69-90.001850.500000.21916
PigmentCarbon black1333-86-40.001850.500000.21916
PolymerEpoxy resin systemProprietary0.025907.000003.06818
Phenolic resinProprietary0.022206.000002.62986
subTotal0.37000100.0000043.83108
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00066
Tin solderTin (Sn)7440-31-50.0099999.940001.18391
subTotal0.01000100.000001.18462
WireImpurityNon hazardousProprietary0.000000.010000.00007
Pure metalGold (Au)7440-57-50.0061599.990000.72858
subTotal0.00615100.000000.72865
total0.84415100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.