Chemical content NX2301P

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
NX2301PSOT23TO-236AB7.98478 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9340646242354126030 s123520 s3Kyoto, Japan; Dongguan, China 
9340646242158126030 s123520 s3Kyoto, Japan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.003922.180000.04914
Doped siliconSilicon (Si)7440-21-30.1644591.360002.05952
Gold alloyGold (Au)7440-57-50.011636.460000.14563
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002460.090000.03085
Carbon (C)7440-44-00.001090.040000.01371
Chromium (Cr)7440-47-30.006020.220000.07541
Cobalt (Co)7440-48-40.011770.430000.14739
Iron (Fe)7439-89-61.3132147.9800016.44645
Manganese (Mn)7439-96-50.023540.860000.29479
Nickel (Ni)7440-02-00.9891536.1400012.38797
Phosphorus (P)7723-14-00.000550.020000.00686
Silicon (Si)7440-21-30.007120.260000.08912
Sulphur (S)7704-34-90.000550.020000.00686
Pure metal layerCopper (Cu)7440-50-80.3112011.370003.89738
Silver (Ag)7440-22-40.070342.570000.88094
Mould CompoundAdditiveNon hazardousProprietary0.141082.900001.76692
FillerSilica -amorphous-7631-86-93.5028072.0000043.86846
PigmentCarbon black1333-86-40.002430.050000.03046
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7297515.000009.13926
Phenol Formaldehyde resin (generic)9003-35-40.4865010.000006.09284
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.010000.00024
Bismuth (Bi)7440-69-90.000040.020000.00048
Iron (Fe)7439-89-60.000020.010000.00024
Lead (Pb)7439-92-10.000020.010000.00024
Tin solderTin (Sn)7440-31-50.1899099.950002.37834
WirePure metalCopper (Cu)7440-50-80.01278100.000000.16001
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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