Chemical content NX2301P

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Type numberPackagePackage descriptionTotal product weight
NX2301PSOT23TO-236AB7.98478 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934064624235412601235Kyoto, Japan; Dongguan, China; Seremban, Malaysia 
934064624215812601235Seremban, Malaysia; Kyoto, Japan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.003922.180000.04914
Doped siliconSilicon (Si)7440-21-30.1644591.360002.05952
Gold alloyGold (Au)7440-57-50.011636.460000.14563
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002460.090000.03085
Carbon (C)7440-44-00.001090.040000.01371
Chromium (Cr)7440-47-30.006020.220000.07541
Cobalt (Co)7440-48-40.011770.430000.14739
Iron (Fe)7439-89-61.3132147.9800016.44645
Manganese (Mn)7439-96-50.023540.860000.29479
Nickel (Ni)7440-02-00.9891536.1400012.38797
Phosphorus (P)7723-14-00.000550.020000.00686
Silicon (Si)7440-21-30.007120.260000.08912
Sulphur (S)7704-34-90.000550.020000.00686
Pure metal layerCopper (Cu)7440-50-80.3112011.370003.89738
Silver (Ag)7440-22-40.070342.570000.88094
Mould CompoundAdditiveNon hazardousProprietary0.141082.900001.76692
FillerSilica -amorphous-7631-86-93.5028072.0000043.86846
PigmentCarbon black1333-86-40.002430.050000.03046
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7297515.000009.13926
Phenol Formaldehyde resin (generic)9003-35-40.4865010.000006.09284
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000110.055500.00132
Tin solderTin (Sn)7440-31-50.1898999.940002.37810
WirePure metalCopper (Cu)7440-50-80.01278100.000000.16001
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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