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Chemical content NX2301P

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
NX2301PSOT23TO-236AB7.98478 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340646242354126030 s123520 s3Kyoto, Japan; Dongguan, China 
9340646242158126030 s123520 s3Kyoto, Japan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.003922.180000.04914
Doped siliconSilicon (Si)7440-21-30.1644591.360002.05952
Gold alloyGold (Au)7440-57-50.011636.460000.14563
subTotal0.18000100.000002.25429
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.002460.090000.03085
Carbon (C)7440-44-00.001090.040000.01371
Chromium (Cr)7440-47-30.006020.220000.07541
Cobalt (Co)7440-48-40.011770.430000.14739
Iron (Fe)7439-89-61.3132147.9800016.44645
Manganese (Mn)7439-96-50.023540.860000.29479
Nickel (Ni)7440-02-00.9891536.1400012.38797
Phosphorus (P)7723-14-00.000550.020000.00686
Silicon (Si)7440-21-30.007120.260000.08912
Sulphur (S)7704-34-90.000550.020000.00686
Pure metal layerCopper (Cu)7440-50-80.3112011.370003.89738
Silver (Ag)7440-22-40.070342.570000.88094
subTotal2.73700100.0000034.27773
Mould CompoundAdditiveNon hazardousProprietary0.141082.900001.76692
Triphenylphosphine603-35-00.002430.050000.03046
FillerSilica -amorphous-7631-86-93.5028072.0000043.86846
PigmentCarbon black1333-86-40.002430.050000.03046
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.7297515.000009.13926
Phenol Formaldehyde resin (generic)9003-35-40.4865010.000006.09284
subTotal4.86500100.0000060.92840
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.010000.00024
Bismuth (Bi)7440-69-90.000040.020000.00048
Iron (Fe)7439-89-60.000020.010000.00024
Lead (Pb)7439-92-10.000020.010000.00024
Tin solderTin (Sn)7440-31-50.1899099.950002.37834
subTotal0.19000100.000002.37954
WirePure metalCopper (Cu)7440-50-80.01278100.000000.16001
subTotal0.01278100.000000.16001
total7.98478100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.