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Chemical content NX7002BKM

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Type numberPackagePackage descriptionTotal product weight
NX7002BKMSOT883XQFN30.86120 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068617315212601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0076076.000000.88249
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0010510.470000.12157
Phenolic resinProprietary0.0013513.530000.15711
subTotal0.01000100.000001.16117
DieDoped siliconSilicon (Si)7440-21-30.03000100.000003.48351
subTotal0.03000100.000003.48351
Lead FrameCopper alloyCopper (Cu)7440-50-80.4016693.4100046.63992
Magnesium (Mg)7439-95-40.000630.146000.07290
Nickel (Ni)7440-02-00.012532.913001.45447
Silicon (Si)7440-21-30.002710.631000.31506
MetallisationGold (Au)7440-57-50.000150.035000.01748
Nickel (Ni)7440-02-00.011852.755001.37558
Palladium (Pd)7440-05-30.000470.110000.05492
subTotal0.43000100.0000049.93033
Mould CompoundFillerSilica -amorphous-7631-86-90.0851023.000009.88156
Silica fused60676-86-00.2220060.0000025.77798
Flame retardantMetal hydroxideProprietary0.011103.000001.28890
ImpurityBismuth (Bi)7440-69-90.001850.500000.21482
PigmentCarbon black1333-86-40.001850.500000.21482
PolymerEpoxy resin systemProprietary0.025907.000003.00743
Phenolic resinProprietary0.022206.000002.57780
subTotal0.37000100.0000042.96331
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00005
Non hazardousProprietary0.000010.055500.00064
Tin solderTin (Sn)7440-31-50.0099999.940001.16047
subTotal0.01000100.000001.16116
WireImpurityNon hazardousProprietary0.000000.010000.00013
Pure metalGold (Au)7440-57-50.0112099.990001.30038
subTotal0.01120100.000001.30051
total0.86120100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.