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Chemical content NX7002BKMB

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Type numberPackagePackage descriptionTotal product weight
NX7002BKMBSOT883BXQFN30.68154 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934068618315112601235Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.33454
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04609
Phenolic resinProprietary0.0004113.530000.05956
subTotal0.00300100.000000.44019
DieDoped siliconSilicon (Si)7440-21-30.03000100.000004.40180
subTotal0.03000100.000004.40180
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09860
Copper (Cu)7440-50-80.2632094.0000038.61842
Tin (Sn)7440-31-50.000670.240000.09860
Zinc (Zn)7440-66-60.000590.210000.08628
Pure metal layerGold (Au)7440-57-50.000220.080000.03287
Nickel (Ni)7440-02-00.013834.940002.02952
Palladium (Pd)7440-05-30.000810.290000.11914
subTotal0.28000100.0000041.08343
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.47401
Silica fused60676-86-00.2040060.0000029.93221
Flame retardantMetal hydroxideProprietary0.010203.000001.49661
ImpurityBismuth (Bi)7440-69-90.001700.500000.24944
PigmentCarbon black1333-86-40.001700.500000.24944
PolymerEpoxy resin systemProprietary0.023807.000003.49209
Phenolic resinProprietary0.020406.000002.99322
subTotal0.34000100.0000049.88702
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00163
Tin solderTin (Sn)7440-31-50.0199999.940002.93277
subTotal0.02000100.000002.93453
WireImpurityNon hazardousProprietary0.000000.010000.00013
Pure metalGold (Au)7440-57-50.0085499.990001.25292
subTotal0.00854100.000001.25305
total0.68154100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.