Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content NX7002BKW

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NX7002BKWSOT323SC-705.668705 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340686211158126030 s123520 s3
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.050000100.0000000.882036
subTotal0.050000100.0000000.882036
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018290.0900000.032261
Carbon (C)7440-44-00.0008130.0400000.014338
Chromium (Cr)7440-47-30.0042670.2100000.075276
Cobalt (Co)7440-48-40.0085340.4200000.150553
Iron (Fe)7439-89-60.95829147.16000016.904940
Manganese (Mn)7439-96-50.0172720.8500000.304690
Nickel (Ni)7440-02-00.72176635.52000012.732474
Phosphorus (P)7723-14-00.0004060.0200000.007169
Silicon (Si)7440-21-30.0050800.2500000.089615
Sulphur (S)7704-34-90.0004060.0200000.007169
Pure metal layerCopper (Cu)7440-50-80.26497313.0400004.674309
Silver (Ag)7440-22-40.0483622.3800000.853133
subTotal2.032000100.00000035.845930
Mould CompoundAdditiveNon hazardousProprietary0.0977302.9000001.724027
Triphenylphosphine603-35-00.0016850.0500000.029725
FillerSilica -amorphous-7631-86-92.42640072.00000042.803427
PigmentCarbon black1333-86-40.0016850.0500000.029725
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.50550015.0000008.917381
Phenol Formaldehyde resin (generic)9003-35-40.33700010.0000005.944920
subTotal3.370000100.00000059.449204
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000060.0030000.000111
Bismuth (Bi)7440-69-90.0000020.0010000.000037
Copper (Cu)7440-50-80.0000020.0010000.000037
Lead (Pb)7439-92-10.0000100.0050000.000185
Tin solderTin (Sn)7440-31-50.20997999.9900003.704179
subTotal0.210000100.0000003.704550
WirePure metalCopper (Cu)7440-50-80.006705100.0000000.118281
subTotal0.006705100.0000000.118281
total5.668705100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.