×

Chemical content NXB0101GW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXB0101GW-Q100SOT363-2SC-885.86066 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691327125512601235Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.21940100.000003.74364
subTotal0.21940100.000003.74364
ComponentAdditiveNon hazardousProprietary0.000255.000000.00427
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.00427
Silica -amorphous-7631-86-90.0025050.000000.04266
PolymerEpoxy resin systemProprietary0.0015030.000000.02559
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.00853
subTotal0.00500100.000000.08532
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400034.86508
Iron (Fe)7439-89-60.048742.310000.83166
Lead (Pb)7439-92-10.000210.010000.00360
Phosphorus (P)7723-14-00.001480.070000.02520
Zinc (Zn)7440-66-60.002530.120000.04320
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23402
subTotal2.11000100.0000036.00276
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.50086
Silica fused60676-86-02.2159070.5700037.80970
PigmentCarbon black1333-86-40.006280.200000.10716
PolymerEpoxy resin systemProprietary0.291719.290004.97736
Phenolic resinProprietary0.186525.940003.18251
subTotal3.14000100.0000053.57759
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.31265
subTotal0.37000100.000006.31328
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0162699.990000.27741
subTotal0.01626100.000000.27744
total5.86066100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.