×

Chemical content NXS0101GW-Q100

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
NXS0101GW-Q100SOT363-2SC-885.82583 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691328125512601235Nijmegen, Netherlands; Bangkok, Thailand; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.18476100.000003.17139
subTotal0.18476100.000003.17139
ComponentAdditiveNon hazardousProprietary0.000255.000000.00429
FillerBisphenol A-epichlorohydrin resin25068-38-60.000255.000000.00429
Silica -amorphous-7631-86-90.0025050.000000.04291
PolymerEpoxy resin systemProprietary0.0015030.000000.02575
Phenol Formaldehyde resin (generic)9003-35-40.0005010.000000.00858
subTotal0.00500100.000000.08582
Lead FrameCopper alloyCopper (Cu)7440-50-82.0433296.8400035.07353
Iron (Fe)7439-89-60.048742.310000.83664
Lead (Pb)7439-92-10.000210.010000.00362
Phosphorus (P)7723-14-00.001480.070000.02535
Zinc (Zn)7440-66-60.002530.120000.04346
Pure metal layerSilver (Ag)7440-22-40.013720.650000.23542
subTotal2.11000100.0000036.21802
Mould CompoundFillerSilica -amorphous-7631-86-90.4396014.000007.54571
Silica fused60676-86-02.2159070.5700038.03575
PigmentCarbon black1333-86-40.006280.200000.10780
PolymerEpoxy resin systemProprietary0.291719.290005.00711
Phenolic resinProprietary0.186525.940003.20154
subTotal3.14000100.0000053.89791
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00019
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00032
Tin solderTin (Sn)7440-31-50.3699699.990006.35039
subTotal0.37000100.000006.35102
WireImpurityNon hazardousProprietary0.000000.010000.00003
Pure metalCopper (Cu)7440-50-80.0160799.990000.27580
subTotal0.01607100.000000.27583
total5.82583100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.